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TLV9001UIDBVR Datasheet(PDF) 93 Page - Texas Instruments |
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TLV9001UIDBVR Datasheet(HTML) 93 Page - Texas Instruments |
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93 / 98 page  www.ti.com EXAMPLE BOARD LAYOUT (5.8) 0.05 MAX ALL AROUND 0.05 MIN ALL AROUND 8X (1.5) 8X (0.45) 6X (0.65) (R ) TYP 0.05 4221848/A 02/2015 TSSOP - 1.2 mm max height PW0008A SMALL OUTLINE PACKAGE SYMM SYMM LAND PATTERN EXAMPLE SCALE:10X 1 4 5 8 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METAL SOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS NOT TO SCALE SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED |
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