TLV9001UIDBVR datasheet(3/98 Pages) TI

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Changes from Revision M (September 2019) to Revision N (January 2020)

Page

• Added 6-pin SC70 package to Device Information table.................................................................................... 1

• Added 6-pin SC70 package to Device Comparison Table .................................................................................6

• Added TLV9001SIDCK (6-Pin SC70) package pinout........................................................................................7

• Added TLV9001S 6-pin SC70 package to Pin Configuration and Functions section......................................... 7

• Added 6-pin SC70 pinout to Pin Functions: TLV9001S ..................................................................................... 7

• Added TLV9001S 6-pin SC70 package to Thermal Information: TLV9001S table........................................... 15

Changes from Revision L (May 2019) to Revision M (September 2019)

Page

• Deleted preview notations for SOT-23-8 (DDF) package................................................................................... 6

• Added link to Shutdown section in all SHDN pin function rows.......................................................................... 7

• Added EMI Rejection section to the Feature Description section.....................................................................26

• Changed the Shutdown section to add more clarity regarding internal pull-up resistor....................................27

Changes from Revision K (March 2019) to Revision L (May 2019)

Page

• Added SOT-23 (8) information to Device Information table................................................................................ 1

• Added SOT-23 DDF package to Device Comparison Table .............................................................................. 6

• Added SOT-23 (DDF) to Pin Configuration and Functions section.....................................................................7

• Added DDF (SOT-23) Thermal Information: TLV9002 table.............................................................................15

Changes from Revision J (January 2019) to Revision K (March 2019)

Page

• Changed TLV9002S ESD Ratings heading to include all TLV9002S packages............................................... 14

• Deleted preview notation from TLV9002SIRUG in Thermal Information table................................................. 16

Changes from Revision I (November 2018) to Revision J (January 2019)

Page

• Deleted preview notation for TLV9002SIRUGR..................................................................................................1

• Changed TLV9004 WQFN(14) package designator to X2QFN(14) package designator................................... 1

• Added RUG package to Device Comparison Table ...........................................................................................6

• Added DGS package to Device Comparison Table ........................................................................................... 6

• Added shutdown devices to Device Comparison Table .....................................................................................6

• Changed TLV9001 DRL package pinout drawing...............................................................................................7

• Changed TLV9001 DRL package pin functions..................................................................................................7

• Deleted package preview note from TLV9002SIRUGR (X2QFN) pinout drawing.............................................. 7

• Added TLV9004IRUC Thermal Information...................................................................................................... 16

• Changed legend of Closed-Loop Gain vs Frequency plot................................................................................ 19

Changes from Revision H (October 2018) to Revision I (November 2018)

Page

• Added TLV9002SIDGS to ESD Ratings table...................................................................................................14

Changes from Revision G (September 2018) to Revision H (October 2018)

Page

• Changed From: TLV9001 DCK Package To: TLV9001T DCK Package............................................................. 7

Changes from Revision F (August 2018) to Revision G (September 2018)

Page

• Added Device Comparison Table ...................................................................................................................... 6

• Changed pin names for all devices and all packages.........................................................................................7

• Changed pin names and I/O designation on some TLV9001 pins .....................................................................7

• Changed the pin number for V+ in the SOIC, TSSOP column of the Pin Functions: TLV9004 table................. 7

Changes from Revision E (July 2018) to Revision F (August 2018)

Page

• Added Scalabe CMOS Amplifier for Low-Cost Applications feature...................................................................1

• Deleted PREVIEW designation on TLV9002 and TLV9004 devices with the TSSOP package. ....................... 1

• Added TLV9001U DBV (SOT-23) pinout drawing to Pin Configuration and Functions section ......................... 7

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TLV9001, TLV9002, TLV9004

SBOS833R – OCTOBER 2017 – REVISED NOVEMBER 2021

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TLV9001UIDBVR Datasheet(PDF) 3 Page - Texas Instruments

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