TLV9001UIDBVR datasheet(4/98 Pages) TI

4 / 98 page

• Added SOT-23 U Pinout to Pin Functions section ............................................................................................. 7

Changes from Revision D (June 2018) to Revision E (July 2018)

Page

• Corrected typo in Description section ................................................................................................................ 1

• Added TLV9001 5-pin X2SON package to Device Information table ................................................................ 1

• Added TLV9001S 6-pin SOT-23 package to Device Information table...............................................................1

• Added TLV9004 14-pin and 16-pin WQFN packages to Device Information table ............................................1

• Added TLV9001 DPW (X2SON) pinout drawing to Pin Configuration and Functions section............................ 7

• Added TLV9001S 6-pin SOT-23 package to Pin Configuration and Functions section...................................... 7

• Added TLV9004 RTE pinout information to Pin Configuration and Functions section .......................................7

• Added DPW (X2SON) and DRL (SOT-553) packages to Thermal Information: TLV9001 table.......................15

• Added Thermal Information: TLV9001S table to Specifications section........................................................... 15

• Added RUG (X2QFN) package to Thermal Information: TLV9002 table.......................................................... 15

• Added RTE (WQFN) and RUC (WQFN) packages to Thermal Information: TLV9004 table............................16

Changes from Revision C (May 2018) to Revision D (June 2018)

Page

• Added shutdown text to Description section.......................................................................................................1

• Added TLV9002S and TLV9004S devices to Device Information table.............................................................. 1

• Added TLV9002S 10-pin X2QFN package to Device Information table............................................................. 1

• Added TLV9002S DGS package pinout information to Pin Configurations and Functions section.................... 7

• Added Thermal Information: TLV9001 table to Specifications section............................................................. 15

• Added Thermal Information: TLV9004 table to Specifications section............................................................. 16

• Added shutdown section to Electrical Characteristics: VS (Total Supply Voltage) = (V+) – (V–) = 1.8 V to 5.5 V

table.................................................................................................................................................................. 17

• Added Shutdown section.................................................................................................................................. 27

Changes from Revision B (March 2018) to Revision C (May 2018)

Page

• Added TLV9002 16-pin TSSOP package to Device Information table............................................................... 1

• Added TLV9002 10-pin X2QFN package to Device Information table................................................................1

• Added TLV9002S DGS package pinout drawing in Pin Configurations and Functions section..........................7

• Added TLV9004 pinout diagram and pin configuration table to Pin Configuration and Functions section ........ 7

• Added TLV9004S pinout diagram and pin configuration table to Pin Configuration and Functions section ...... 7

• Changed TLV9002 D (SOIC) junction-to-ambient thermal resistance value from 147.4°C/W to 207.9°C/W... 15

• Changed TLV9002 D (SOIC) junction-to-case (top) thermal resistance from 94.3°C/W to 92.8°C/W..............15

• Changed TLV9002 D (SOIC) junction-to-board thermal resistance from 89.5°C/W to 129.7°C/W...................15

• Changed TLV9002 D (SOIC) junction-to-top characterization parameter from 47.3°C/W to 26°C/W.............. 15

• Changed TLV9002 D (SOIC) junction-to-board characterization parameter from 89°C/W to 127.9°C/W........ 15

• Added DGK (VSSOP) thermal information to Thermal Information: TLV9002 table ........................................15

• Added TLV9002 PW (TSSOP) thermal information to Thermal Information: TLV9002 table........................... 15

• Added PW (TSSOP) thermal information to Thermal Information: TLV9002 table ..........................................16

Changes from Revision A (December 2017) to Revision B (March 2018)

Page

• Added package preview notes to TLV9001 packages, TLV9004 packages, and TLV9002 8-pin VSSOP

package in Device Information table ..................................................................................................................1

• Added package preview notes to TLV9001, TLV9004 and TLV9002 VSSOP package pinout drawings in Pin

Configuration and Functions section ................................................................................................................. 7

• Deleted package preview note from TLV9002 DSG (WSON) pinout drawing in Pin Configurations and

Functions section................................................................................................................................................7

• Deleted package preview note from TLV9002 RUG (X2QFN) pinout drawing in Pin Configurations and

Functions section................................................................................................................................................7

• Added DSG (WSON) package thermal information to the Thermal Information: TLV9002 table..................... 15

• Deleted package preview note from DSG (WSON) package in Thermal Information: TLV9002 table............. 15

• Added D (SOIC) package thermal information to the Thermal Information: TLV9004 table.............................16

TLV9001, TLV9002, TLV9004

SBOS833R – OCTOBER 2017 – REVISED NOVEMBER 2021

www.ti.com

Submit Document Feedback

Product Folder Links: TLV9001 TLV9002 TLV9004

TLV9001UIDBVR Datasheet(PDF) 4 Page - Texas Instruments

TLV9001UIDBVR Datasheet(HTML) 4 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98

Datasheet Download

Link URL