TLV9152SIRUGR datasheet(2/77 Pages) TI

2 / 77 page

Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 1

3 Description.......................................................................1

4 Revision History.............................................................. 2

5 Pin Configuration and Functions...................................4

6 Specifications.................................................................. 9

6.1 Absolute Maximum Ratings........................................ 9

6.2 ESD Ratings............................................................... 9

6.3 Recommended Operating Conditions.........................9

6.4 Thermal Information for Single Channel..................... 9

6.5 Thermal Information for Dual Channel......................10

6.6 Thermal Information for Quad Channel.................... 10

6.7 Electrical Characteristics...........................................11

6.8 Typical Characteristics.............................................. 15

7 Detailed Description......................................................22

7.1 Overview................................................................... 22

7.2 Functional Block Diagram......................................... 22

7.3 Feature Description...................................................23

7.4 Device Functional Modes..........................................30

8 Application and Implementation.................................. 31

8.1 Application Information............................................. 31

8.2 Typical Applications.................................................. 31

9 Power Supply Recommendations................................33

10 Layout...........................................................................33

10.1 Layout Guidelines................................................... 33

10.2 Layout Example...................................................... 34

11 Device and Documentation Support..........................35

11.1 Device Support........................................................35

11.2 Documentation Support.......................................... 35

11.3 Receiving Notification of Documentation Updates.. 35

11.4 Support Resources................................................. 35

11.5 Trademarks............................................................. 36

11.6 Electrostatic Discharge Caution.............................. 36

11.7 Glossary.................................................................. 36

12 Mechanical, Packaging, and Orderable

Information.................................................................... 37

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision D (May 2021) to Revision E (January 2022)

Page

• Updated industry standard packages in Features to match the packages available in Device Information

section ............................................................................................................................................................... 1

• Added SOT-23-14 (DYY) package to Device Information ................................................................................. 1

• Added SOT-23-14 (DYY) package and pin functions in Pin Configurations and Functions section................... 4

• Removed WQFN-14 (RTE) package and pin functions in Pin Configurations and Functions section................4

• Removed WQFN-16 (RTE) package and pin functions in Pin Configurations and Functions section................4

• Corrected typo mislabeling the RUC package as having an "Exposed Thermal Pad" in Pin Configurations and

Functions section................................................................................................................................................4

• Removed SOT-553 (DRL) package and pin functions from Pin Configurations and Functions section............. 4

• Removed SOT-563 (DRL) package and pin functions from Pin Configurations and Functions section............. 4

• Corrected typo in Recommended Operating Conditions which labeled VIH as amplifier enabled and VIL as

amplifier disabled to correctly label VIH as amplifier disabled and VIL as amplifier enabled...............................9

• Added SOT-23-14 (DYY) package in Thermal Information for Quad Channel section.....................................10

• Corrected typo mislabeling the RUC package as a "WQFN" package instead of as a "X2QFN" package in

Thermal Information for Quad Channel section................................................................................................10

• Removed "TLV9154S" from header of Thermal Information for Quad Channel section...................................10

• Maximum PSRR specification from VS = 4 V to 16 V changed from ±1 μV/V to ±1.6 μV/V..............................11

• Maximum PSRR specification from VS = 2.7 V to 16 V changed from ±5 μV/V to ±8.64 μV/V.........................11

• Minimum CMRR specification for VS = 16 V changed from 109dB to 99dB..................................................... 11

• Corrected typo in IQSD test conditions in Electrical Characteristics table from "SHDN = V–" to "SHDN = V– + 2

V"...................................................................................................................................................................... 11

• Removed the overbar from the SHDN pin name in the note on toff and ton in the Electrical Characteristics

section for consistency......................................................................................................................................11

• Updated Figure EMIRR Testing and Table TLV9151 EMIRR IN+ for Frequencies of Interest in EMI Rejection

to match the increased performance from Figure EMIRR (Electromagnetic Interference Rejection Ratio) vs

Frequency in Electrical Characteristics ............................................................................................................23

• Changed input resistor values in Equivalent Internal ESD Circuitry Relative to a Typical Circuit Application in

Electrical Overstress section to more closely resemble device ....................................................................... 27

• Removed WQFN (RTE) package from Packages With an Exposed Thermal Pad ..........................................29

TLV9151, TLV9152, TLV9154

SBOS986E – OCTOBER 2019 – REVISED JANUARY 2022

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