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DLPS033 Datasheet(PDF) 13 Page - Texas Instruments

Part # DLPS033
Description  DLPR410 Configuration PROM
PDF  21 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

DLPS033 Datasheet(HTML) 13 Page - Texas Instruments

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9 Power Supply Recommendations
The DLPR410 uses two power supply rails as shown in Table 9-1.
Table 9-1. DLPR410 Power Supply Rails
SUPPLY
POWER PINS
COMMENTS
1.8 V
VCCINT1, VCCINT2, and VCCINT3
All VCCINT pins must be connected with a 0.1-µF and a
0.047-μF decoupling capacitor to GND.
2.5 V
VCCO1,VCCO2,VCCO3, VCCO4, and VCCJ
All VCCO and VCCJ pins must be connected with a 0.1-
µF and a 0.047-μF decoupling capacitor to GND.
10 Layout
10.1 Layout Guidelines
The DLPR410 is part of a multi-chipset solution. It is required to be used with the DLPC410ZYR Controller to
provide reliable control of any attached DMDs. These guidelines are targeted at designing a PCB board with the
DLPR410.
10.1.1 Component Placement
The DLPR410 must be placed adjacent to the DLPC410ZYR Controller with a maximum electrical distance of 4
inches (10 cm).
10.1.2 Impedance Requirements
Signals between the DLPR410 and the DLPC410ZYR Controller must be routed to have a matched impedance
of 50 Ω ±10%.
10.1.3 PCB Signal Routing
When designing a PCB board which includes the DLPR410 and the DLPC410ZYR Controller, the following are
recommended:
Signal trace corners must be no sharper than 45°. Adjacent signal layers must have the predominate traces
routed orthogonal to each other.
TI does not recommend signal routing on power or ground planes.
TI does not recommend ground plane slots.
High speed signal traces must not cross over slots in adjacent power and/or ground planes.
10.1.4 Fiducials
Fiducials for automatic component insertion must be 0.05-inch copper with a 0.1-inch cutout (antipad). Fiducials
for optical auto insertion are placed on three corners of both sides of the PCB.
10.1.5 PCB Decoupling Guidelines
Decoupling capacitors must be utilized to provide instantaneous current sources to components and to help
mitigate ground bounce.
10.1.5.1 Bulk Decoupling
Bulk decoupling capacitors for the board must be distributed around the PCB and be sized to handle the current
demands for the board.
10.1.5.1.1 DLPR410 Decoupling Capacitors
Decoupling capacitors (0.1 µF recommended) are placed to minimize the distance from the decoupling capacitor
to the supply and ground pins of the component. It is recommended that the placement of and routing for the
decoupling capacitors meet the following guidelines:
• The supply voltage pin of the capacitor must be located close to the device supply voltage pin(s). The
decoupling capacitor must have vias to ground and voltage planes. The device can be connected directly to
www.ti.com
DLPR410
DLPS027G – AUGUST 2012 – REVISED AUGUST 2021
Copyright © 2021 Texas Instruments Incorporated
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Product Folder Links: DLPR410



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