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TLV9151, TLV9152, TLV9154

SBOS986B – OCTOBER 2019 – REVISED MAY 2020

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Product Folder Links: TLV9151 TLV9152 TLV9154

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Copyright © 2019–2020, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 3

6

Specifications....................................................... 10

6.1

Absolute Maximum Ratings .................................... 10

6.2

ESD Ratings............................................................ 10

6.3

Recommended Operating Conditions ..................... 10

6.4

Thermal Information for Single Channel ................. 10

6.5

Thermal Information for Dual Channel.................... 11

6.6

Thermal Information for Quad Channel .................. 11

6.7

Electrical Characteristics......................................... 12

6.8

Typical Characteristics ............................................ 15

7

Detailed Description ............................................ 22

7.1

Overview ................................................................. 22

7.2

Functional Block Diagram ....................................... 22

7.3

Feature Description................................................. 23

7.4

Device Functional Modes........................................ 30

8

Application and Implementation ........................ 31

8.1

Application Information............................................ 31

8.2

Typical Applications ................................................ 31

9

Power Supply Recommendations ...................... 33

10

Layout................................................................... 33

10.1

Layout Guidelines ................................................. 33

10.2

Layout Example .................................................... 34

11

Device and Documentation Support ................. 35

11.1

Device Support...................................................... 35

11.2

Documentation Support ........................................ 35

11.3

Related Links ........................................................ 35

11.4

Receiving Notification of Documentation Updates 35

11.5

Support Resources ............................................... 35

11.6

Trademarks ........................................................... 36

11.7

Electrostatic Discharge Caution ............................ 36

11.8

Glossary ................................................................ 36

12

Mechanical, Packaging, and Orderable

Information ........................................................... 37

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision A (March 2020) to Revision B

Page

•

Changed X2QFN (10) package status on Device Information from Preview to Active ......................................................... 1

•

Removed preview notation on X2QFN (RUG) package in Pin Configurations and Functions............................................... 6

•

•

Added SHUTDOWN in Electrical Characteristics table ........................................................................................................ 10

Changes from Original (October 2019) to Revision A

Page

•

Changed document status from Advance Information to Production Data ............................................................................ 1

•

Changed SOIC (8) package status on Device Information from Preview to Active .............................................................. 1

•

Changed TSSOP (8) package status on Device Information from Preview to Active ........................................................... 1

•

Changed WSON (8) package status on Device Information from Preview to Active ............................................................ 1

•

Removed preview notation on SOIC (D), TSSOP (PW), and WSON (DSG) packages in Pin Configurations and

Functions ................................................................................................................................................................................ 5

•

Added Typical Characteristics section in Specifications section .......................................................................................... 15