© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com

C1081_C0G_HV_FT_AUTO_SMD • 6/8/2017

15

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System (HV FT-CAP), C0G Dielectric, 500 – 3,000 VDC (Automotive Grade)

Figure 1 – Embossed (Plastic) Carrier Tape Dimensions

Po

T

F

W

Center Lines of Cavity

Ao

Bo

User Direction of Unreeling

Cover Tape

Ko

including draft concentric about Bo.

ØDo

Embossment

For cavity size,

see Note 1 Table 4

[10 pitches cumulative

tolerance on tape ± 0.2 mm]

Table 6 – Embossed (Plastic) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

Tape Size

D

0

D

Note 1

E

1

P

0

P

2

R Reference

Note 2

S

Note 3

T

Maximum

T

1

Maximum

8 mm

1.5 +0.10/-0.0

(0.059 +0.004/-

0.0)

1.0

(0.039)

1.75 ±0.10

(0.069 ±0.004)

4.0 ±0.10

(0.157 ±0.004)

2.0 ±0.05

(0.079 ±0.002)

25.0

(0.984)

0.600

(0.024)

0.600

(0.024)

0.100

(0.004)

12 mm

1.5

(0.059)

30

(1.181)

16 mm

Variable Dimensions — Millimeters (Inches)

Tape Size

Pitch

B

Note 4

E

2

Minimum

F

P

1

T

2

Maximum

W

Maximum

A

8 mm

Single (4 mm)

4.35

(0.171)

6.25

(0.246)

3.5 ±0.05

(0.138 ±0.002)

4.0 ±0.10

(0.157 ±0.004)

2.5

(0.098)

8.3

(0.327)

Note 5

12 mm

Single (4 mm) &

Double (8 mm)

8.2

(0.323)

10.25

(0.404)

5.5 ±0.05

(0.217 ±0.002)

8.0 ±0.10

(0.315 ±0.004)

4.6

(0.181)

12.3

(0.484)

16 mm

Triple (12 mm)

12.1

(0.476)

14.25

(0.561)

7.5 ±0.05

(0.138 ±0.002)

12.0 ±0.10

(0.157 ±0.004)

4.6

(0.181)

16.3

(0.642)

1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment

location and hole location shall be applied independent of each other.

2. The tape with or without components shall pass around R without damage (see Figure 6).

3. If S

4. B

5. The cavity defined by A

(a) the component does not protrude above the top surface of the carrier tape.

(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).

(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see

Figure 4).

(e) for KPS Series product, A

(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.