© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com

C1081_C0G_HV_FT_AUTO_SMD • 6/8/2017

12

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System (HV FT-CAP), C0G Dielectric, 500 – 3,000 VDC (Automotive Grade)

Soldering Process

Recommended Soldering Technique:

• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206

• All other EIA case sizes are limited to solder reflow only

Recommended Reflow Soldering Profile:

KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual),

convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal

stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J-

STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at

these conditions.

Storage and Handling

Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in

other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,

and long term storage. In addition, packaging materials will be degraded by high temperature–reels may soften or warp

and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum

storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on

the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock

should be used promptly, preferably within 1.5 years of receipt.

Profile Feature

Termination Finish

SnPb

100% Matte Sn

Preheat/Soak

Temperature Minimum (T

100°C

150°C

Temperature Maximum (T

150°C

200°C

Time (t

60 – 120 seconds

60 – 120 seconds

Ramp-Up Rate (T

3°C/second

maximum

3°C/second

maximum

Liquidous Temperature (T

183°C

217°C

Time Above Liquidous (t

60 – 150 seconds

60 – 150 seconds

Peak Temperature (T

235°C

260°C

Time Within 5°C of Maximum

Peak Temperature (t

20 seconds

maximum

30 seconds

maximum

Ramp-Down Rate (T

6°C/second

maximum

6°C/second

maximum

Time 25°C to Peak

Temperature

6 minutes

maximum

8 minutes

maximum

Note 1: All temperatures refer to the center of the package, measured on the

capacitor body surface that is facing up during assembly reflow.

Time

T

smin

25

T

smax

T

L

T

P

Maximum Ramp Up Rate = 3ºC/sec

Maximum Ramp Down Rate = 6ºC/sec

t

P

t

L

t

s

25ºC to Peak