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SW045R02VT Datasheet(PDF) 1 Page - Xian Semipower Electronic Technology Co., Ltd.

Part # SW045R02VT
Description  N-channel Enhanced mode DFN3*3 MOSFET
PDF  6 Pages
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Manufacturer  SEMIPOWER [Xian Semipower Electronic Technology Co., Ltd.]
Direct Link  http://www.samwinsemi.com
Logo SEMIPOWER - Xian Semipower Electronic Technology Co., Ltd.

SW045R02VT Datasheet(HTML) 1 Page - Xian Semipower Electronic Technology Co., Ltd.

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Copyright@ SEMIPOWER Electronic Technology Co., Ltd. All rights reserved.
Mar. 2017. Rev. 2.0
1/6
SW045R02VT
Absolute maximum ratings
Symbol
Parameter
Value
Unit
V
DSS
Drain to source voltage
20
V
I
D
Continuous drain current (@T
C=25
oC)
80*
A
Continuous drain current (@T
C=100
oC)
50*
A
I
DM
Drain current pulsed
(note 1)
320
A
V
GS
Gate to source voltage
± 12
V
E
AS
Single pulsed avalanche energy
(note 2)
122
mJ
E
AR
Repetitive avalanche energy
(note 1)
9
mJ
dv/dt
Peak diode recovery dv/dt
(note 3)
5
V/ns
P
D
Total power dissipation (@Ta=25oC)
2.6
W
Derating factor above 25oC
0.02
W/oC
T
STG, TJ
Operating junction temperature & storage temperature
-55 ~ + 150
oC
Thermal characteristics
Symbol
Parameter
Value
Unit
R
thja
Thermal resistance, Junction to ambient
48
oC/W
*. Drain current is limited by junction temperature.
Order Codes
Item
Sales Type
Marking
Package
Packaging
1
SW H 045R02VT
SW045R02V
DFN3*3
REEL
N-channel Enhanced mode DFN3*3 MOSFET
Features
 High ruggedness
 Low R
DS(ON) (Typ 4.6mΩ)@VGS=2.5V
Low R
DS(ON) (Typ 3.7mΩ)@VGS=4.5V
Low R
DS(ON) (Typ 3.3mΩ)@VGS=10V
 Low Gate Charge (Typ 49nC)
 Improved dv/dt Capability
 100% Avalanche Tested
 Application: DC-DC Converter,Motor Control
Synchronous Rectification
General Description
This power MOSFET is produced with advanced technology of SAMWIN.
This technology enable the power MOSFET to have better characteristics, including fast
switching time, low on resistance, low gate charge and especially excellent avalanche
characteristics.
BV
DSS : 20V
I
D
: 80A
R
DS(ON) : 4.6mΩ@VGS=2.5V
3.7m
Ω@V
GS=4.5V
3.3m
Ω@V
GS=10V
G
D
S
DFN3*3
Gate:4 Drain:5,6,7,8 Source:1,2,3
G(4) D(5,6,7,8)
S(1,2,3)
Note: R
thja is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is d
efined as the solder mounting surface of the drain pins. R
thjc is guaranteed by design while Rthca is determined by the user's
board design.
DFN3*3 R
thja : 48
oC/W on a 1 in2 pad of 2oz copper.


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