TFP201, TFP201A

TI PanelBus DIGITAL RECEIVER

SLDS116A - MARCH 2000 – REVISED JUNE 2000

15

POST OFFICE BOX 655303

Table 1 outlines the thermal properties of the TI 100-TQFP PowerPAD

 package. The 100-TQFP non-

PowerPAD

 package is included only for reference.

Table 1. TI 100-TQFP (14

× 14 × 1 mm)/0.5 mm Lead Pitch

PARAMETER

WITHOUT

PowerPAD



PowerPAD



NOT CONNECTED TO PCB

THERMAL PLANE

PowerPAD



CONNECTED TO PCB

THERMAL PLANE†

Theta-JA†,‡

45

°C/W

27.3

°C/W

17.3

°C/W

Theta-JC†,‡

3.11

°C/W

0.12

°C/W

0.12

°C/W

Maximum power dissipation†,‡,§

1.6 W

2.7 W

4.3 W

† Specified with 2 oz. Cu PCB plating.

‡ Airflow is at 0 LFM (no airflow)

§ Measured at ambient temperature, TA = 70°C.