ADA4939-2YCPZ-R2 datasheet(7/24 Pages) AD

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Data Sheet

ADA4939-1/ADA4939-2

Rev. A | Page 7 of 24

ABSOLUTE MAXIMUM RATINGS

Table 7.

Parameter

Rating

Supply Voltage

5.5 V

Power Dissipation

See Figure 4

Input Current, +IN, −IN, PD

±5 mA

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

ADA4939-1

−40°C to +105°C

ADA4939-2

−40°C to +105°C

Lead Temperature (Soldering, 10 sec)

300°C

Junction Temperature

150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

θJA is specified for the device (including exposed pad) soldered

to a high thermal conductivity 2s2p circuit board, as described

in EIA/JESD 51-7.

Table 8. Thermal Resistance

Package Type

θJA

Unit

ADA4939-1, 16-Lead LFCSP (Exposed Pad)

°C/W

ADA4939-2, 24-Lead LFCSP (Exposed Pad)

°C/W

MAXIMUM POWER DISSIPATION

The maximum safe power dissipation for the ADA4939-1/

ADA4939-2 package is limited by the associated rise in junction

temperature (TJ) on the die. At approximately 150°C, which is

the glass transition temperature, the plastic changes its properties.

Even temporarily exceeding this temperature limit can change

the stresses that the package exerts on the die, permanently

shifting the parametric performance of the ADA4939-1/

ADA4939-2. Exceeding a junction temperature of 150°C for an

extended period can result in changes in the silicon devices,

potentially causing failure.

The power dissipated in the package (PD) is the sum of the

quiescent power dissipation and the power dissipated in the

package due to the load drive. The quiescent power is the voltage

between the supply pins (VS) times the quiescent current (IS).

The power dissipated due to the load drive depends upon the

particular application. Calculate the power due to the load drive

by multiplying the load current by the associated voltage drop

across the device. RMS voltages and currents must be used in

these calculations.

Airflow increases heat dissipation, effectively reducing θJA. In

addition, more metal directly in contact with the package leads/

exposed pad from metal traces, through holes, ground, and power

planes reduces θJA.

Figure 4 shows the maximum safe power dissipation in the

package vs. the ambient temperature for the single 16-lead

LFCSP (98°C/W) and the dual 24-lead LFCSP (67°C/W) on a

JEDEC standard 4-layer board with the exposed pad soldered to

a PCB pad that is connected to a solid plane.

3.0

2.5

2.0

1.5

1.0

0.5

–40

100

–20

AMBIENT TEMPERATURE (°C)

ADA4939-1

ADA4939-2

Figure 4. Maximum Power Dissipation vs. Ambient Temperature for

a 4-Layer Board

ESD CAUTION

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