LMV342MASLASHNOPB datasheet(5/35 Pages) TI1

5 / 35 page

LMV341-N, LMV342-N, LMV344-N

www.ti.com

SNOS990H – APRIL 2002 – REVISED JUNE 2016

Product Folder Links: LMV341-N LMV342-N LMV344-N

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

Shorting output to V+ will adversely affect reliability.

(4)

Shorting output to V- will adversely affect reliability.

(5)

The maximum power dissipation is a function of TJ(MAX), RθJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) – TA) / RθJA. All numbers apply for packages soldered directly onto a PCB.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

Differential input voltage

±Supply voltage

Supply voltage (V + – V –)

Output short circuit to V +

See(3)

Output short circuit to V –

See(4)

Lead temperature

Infrared or convection reflow (20 s)

235

°C

Wave soldering (10 s)

260

Junction temperature, TJ

(5)

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

Human Body Model, applicable std. MIL-STD-883, Method 3015.7.

(2)

Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC) Field-Induced Charge-Device Model, applicable std. JESD22-

C101-C (ESD FICDM std. of JEDEC).

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM)(1)

±2000

Machine model (MM)(2)

±200

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage

2.7

5.5

Temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

LMV341-N

LMV342-N

LMV344-N

UNIT

DCK

(SC70)

(SOIC)

DGK

(VSSOP)

(SOIC)

(TSSOP)

6 PINS

8 PINS

14 PINS

RθJA

Junction-to-ambient thermal resistance

414

190

235

145

155

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

116.1

65.2

68.4

45.9

50.5

°C/W

RθJB

Junction-to-board thermal resistance

53.3

61.4

98.8

44.1

66.2

°C/W

ψJT

Junction-to-top characterization

parameter

8.8

16.1

9.8

10.2

6.3

°C/W

ψJB

Junction-to-board characterization

parameter

52.7

60.8

97.3

43.7

65.6

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal

resistance

—

°C/W

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