TPS732

SBVS037P – AUGUST 2003 – REVISED DECEMBER 2015

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Table of Contents

1

Features .................................................................. 1

8

Application and Implementation ........................ 16

8.1

Application Information............................................ 16

2

Applications ........................................................... 1

8.2

Typical Applications ................................................ 16

3

Description ............................................................. 1

9

Power Supply Recommendations ...................... 19

4

Revision History..................................................... 2

10

Layout................................................................... 19

5

Pin Configuration and Functions ......................... 3

10.1

Layout Guidelines ................................................. 19

6

Specifications......................................................... 4

10.2

Layout Examples................................................... 19

6.1

Absolute Maximum Ratings ...................................... 4

10.3

Thermal Considerations ........................................ 20

6.2

ESD Ratings ............................................................ 4

11

Device and Documentation Support ................. 22

6.3

Recommended Operating Conditions ....................... 4

11.1

Device Support...................................................... 22

6.4

Thermal Information .................................................. 5

11.2

Documentation Support ....................................... 22

6.5

Electrical Characteristics........................................... 6

11.3

Related Links ........................................................ 22

6.6

Switching Characteristics .......................................... 6

11.4

Community Resources.......................................... 23

6.7

Typical Characteristics .............................................. 7

11.5

Trademarks ........................................................... 23

7

Detailed Description ............................................ 12

11.6

Electrostatic Discharge Caution ............................ 23

7.1

Overview ................................................................. 12

11.7

Glossary ................................................................ 23

7.2

Functional Block Diagrams ..................................... 12

12

Mechanical, Packaging, and Orderable

7.3

Feature Description................................................. 13

Information ........................................................... 23

7.4

Device Functional Modes........................................ 15

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision O (August 2010) to Revision P

Page

•

Changed Features bullet about NMOS topology; deleted "new"............................................................................................ 1

•

Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation

section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and

Mechanical, Packaging, and Orderable Information section ................................................................................................. 1

•

Changed first paragraph of Description section; deleted description of NMOS topology as "new" ....................................... 1

•

Changed Pin Configuration and Functions section; updated table format ............................................................................ 3

•

Changed "free-air temperature" to "junction temperature" in Absolute Maximum Ratings condition statement ................... 4

•

Changed Thermal Information table; updated thermal resistance values for all packages .................................................. 5

Changes from Revision N (August, 2009) to Revision O

Page

•

Replaced the Dissipation Ratings table with the Thermal Information table .......................................................................... 6

Changes from Revision M (May, 2008) to Revision N

Page

•

Changed Figure 10 ................................................................................................................................................................ 7

•

Added paragraph about recommended start-up sequence to Internal Current Limit section .............................................. 14

•

Added paragraph about current foldback and device start-up to Enable Pin and Shutdown section .................................. 14

2

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