PCF8574_PCF8574A

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Product data sheet

Rev. 5 — 27 May 2013

25 of 33

NXP Semiconductors

PCF8574; PCF8574A

18.4 Package related soldering information

[1]

For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit

board.

[2]

For PMFP packages hot bar soldering or manual soldering is suitable.

Table 13.

Suitability of through-hole mount IC packages for dipping and wave soldering

Package

Soldering method

Dipping

Wave

CPGA, HCPGA

-

suitable

DBS, DIP, HDIP, RDBS, SDIP, SIL

suitable

suitable[1]

PMFP[2]

-

not suitable