360 datasheet(5/95 Pages) INTEL

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Datasheet

Figures

1VCC Static and Transient Tolerance for 775_VR_CONFIG_05A and 775_VR_CONFIG_06

Processors .............................................................................................................. 21

2VCC Overshoot Example Waveform ............................................................................. 22

Phase Lock Loop (PLL) Filter Requirements .................................................................. 31

Processor Package Assembly Sketch ........................................................................... 33

Processor Package Drawing (Sheet 1 of 3)................................................................... 34

Processor Package Drawing (Sheet 2 of 3)................................................................... 35

Processor Package Drawing (Sheet 3 of 3)................................................................... 36

Processor Top-Side Marking Example.......................................................................... 38

Processor Land Coordinates and Quadrants (Top View) ................................................. 39

10 land-out Diagram (Top View – Left Side) ..................................................................... 42

11 land-out Diagram (Top View – Right Side) ................................................................... 43

12 Thermal Profile for 775_VR_CONFIG_05A Processors .................................................... 77

13 Thermal Profile for 775_VR_CONFIG_06 Processors ...................................................... 78

14 Case Temperature (TC) Measurement Location ............................................................ 79

15 Processor Low Power State Machine ........................................................................... 86

16 Mechanical Representation of the Boxed Processor ....................................................... 89

17 Space Requirements for the Boxed Processor (Side View: applies to all four side views) .... 90

18 Space Requirements for the Boxed Processor (Top View)............................................... 90

Space Requirements for the Boxed Processor (Overall View) ......................................... 91

20 Boxed Processor Fan Heatsink Power Cable Connector Description .................................. 92

21 Baseboard Power Header Placement Relative to Processor Socket ................................... 93

22 Boxed Processor Fan Heatsink Airspace Keep-out Requirements

(Side 1 View) .......................................................................................................... 94

23 Boxed Processor Fan Heatsink Airspace Keep-out Requirements

(Side 2 View) .......................................................................................................... 94

360 Datasheet(PDF) 5 Page - Intel Corporation