360 datasheet(3/95 Pages) INTEL

3 / 95 page

Datasheet

Contents

Introduction.................................................................................................................9

1.1

Terminology .......................................................................................................9

1.1.1

Processor Packaging Terminology ............................................................. 10

1.2

References ....................................................................................................... 11

Electrical Specifications ............................................................................................... 13

2.1

Power and Ground Lands.................................................................................... 13

2.2

Decoupling Guidelines........................................................................................ 13

2.2.1

VCC Decoupling ..................................................................................... 13

2.2.2

VTT Decoupling...................................................................................... 14

2.2.3

FSB Decoupling...................................................................................... 14

2.3

Voltage Identification ......................................................................................... 14

2.4

Reserved, Unused, and TESTHI Signals ................................................................ 16

2.5

Voltage and Current Specification ........................................................................ 17

2.5.1

Absolute Maximum and Minimum Ratings .................................................. 17

2.5.2

DC Voltage and Current Specification ........................................................ 18

2.5.3

VCC Overshoot ...................................................................................... 21

2.5.4

Die Voltage Validation ............................................................................. 22

2.6

Signaling Specifications...................................................................................... 22

2.6.1

FSB Signal Groups.................................................................................. 23

2.6.2

GTL+ Asynchronous Signals..................................................................... 25

2.6.3

Processor DC Specifications ..................................................................... 25

2.6.3.1

GTL+ Front Side Bus Specifications ............................................. 28

2.7

Clock Specifications ........................................................................................... 29

2.7.1

Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ............................ 29

2.7.2

FSB Frequency Select Signals (BSEL[2:0])................................................. 30

2.7.3

Phase Lock Loop (PLL) and Filter .............................................................. 30

2.7.4

BCLK[1:0] Specifications ......................................................................... 32

Package Mechanical Specifications ................................................................................ 33

3.1

Package Mechanical Drawing............................................................................... 33

3.2

Processor Component Keep-Out Zones................................................................. 37

3.3

Package Loading Specifications ........................................................................... 37

3.4

Package Handling Guidelines............................................................................... 37

3.5

Package Insertion Specifications.......................................................................... 38

3.6

Processor Mass Specification............................................................................... 38

3.7

Processor Materials............................................................................................ 38

3.8

Processor Markings............................................................................................ 38

3.9

Processor Land Coordinates ................................................................................ 39

Land Listing and Signal Descriptions ............................................................................. 41

4.1

Processor Land Assignments ............................................................................... 41

4.2

Alphabetical Signals Reference ............................................................................ 64

Thermal Specifications and Design Considerations........................................................... 75

5.1

Processor Thermal Specifications ......................................................................... 75

5.1.1

Thermal Specifications ............................................................................ 75

5.1.2

Thermal Metrology ................................................................................. 79

5.2

Processor Thermal Features ................................................................................ 79

5.2.1

Thermal Monitor..................................................................................... 79

5.2.2

On-Demand Mode .................................................................................. 80

5.2.3

PROCHOT# Signal .................................................................................. 81

5.2.4

THERMTRIP# Signal ............................................................................... 81

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