7

LTK001

001fa

OBSOLETE PACKAGE

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

PACKAGE DESCRIPTIO

J8 0801

.014 – .026

(0.360 – 0.660)

.200

(5.080)

MAX

.015 – .060

(0.381 – 1.524)

.125

3.175

MIN

.100

(2.54)

BSC

.300 BSC

(7.62 BSC)

.008 – .018

(0.203 – 0.457)

0° – 15°

.005

(0.127)

MIN

.405

(10.287)

MAX

.220 – .310

(5.588 – 7.874)

12

3

4

87

65

.025

(0.635)

RAD TYP

.045 – .068

(1.143 – 1.650)

FULL LEAD

OPTION

.023 – .045

(0.584 – 1.143)

HALF LEAD

OPTION

CORNER LEADS OPTION

(4 PLCS)

.045 – .065

(1.143 – 1.651)

NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE

OR TIN PLATE LEADS

J8 Package

8-Lead CERDIP (Narrow .300 Inch, Hermetic)

(Reference LTC DWG # 05-08-1110)