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M24C01WDW6TP Datasheet(PDF) 30 Page - STMicroelectronics |
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M24C01WDW6TP Datasheet(HTML) 30 Page - STMicroelectronics |
30 / 34 page Part numbering M24C16, M24C08, M24C04, M24C02, M24C01 30/34 8 Part numbering For a list of available options (speed, package, etc.) or for further information on any aspect of this device, please contact your nearest ST sales office. The category of second-level interconnect is marked on the package and on the inner box label, in compliance with JEDEC standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. Table 22. Ordering information scheme Example: M24C16 – W DW 3 T P /S Device type M24 = I2C serial access EEPROM Device Function 16 = 16 Kbit (2048 x 8) 08 = 8 Kbit (1024 x 8) 04 = 4 Kbit (512 x 8) 02 = 2 Kbit (256 x 8) 01 = 1 Kbit (128 x 8) Operating voltage W = VCC = 2.5 V to 5.5 V (400 kHz) R = VCC = 1.8 V to 5.5 V (400 kHz) F = VCC = 1.7 V to 5.5 V (400 kHz) Package BN = PDIP8 MN = SO8 (150 mil width) MB = UFDFPN8 (MLP8) DW = TSSOP8 (169 mil width) DS = TSSOP8 (3 x 3 mm body size, MSOP8)(1) 1. Products sold in this package are not recommended for new design. Device grade 6 = Industrial: device tested with standard test flow over –40 to 85 °C 3 = Automotive: device tested with high reliability certified flow(2) over –40 to 125 °C 2. ST strongly recommends the use of the Automotive Grade devices for use in an automotive environment. The High Reliability Certified Flow (HRCF) is described in the quality note QNEE9801. Please ask your nearest ST sales office for a copy. 5 = Consumer: device tested with standard test flow over –20 to 85 °C. Option T = Tape and reel packing Plating technology P or G = ECOPACK® (RoHS compliant) Process(3) 3. Used only for device grade 3. /S = F6SP36% |
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