M24512-R datasheet(27/35 Pages) STMICROELECTRONICS

27 / 35 page

M24512-x, M24256-Bx

Package mechanical data

27/35

Package mechanical data

In order to meet environmental requirements, ST offers the M24512-W in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at www.st.com.

Figure 13.

SO8W – 8-lead plastic small outline, 208 mils body width, package outline

Drawing is not to scale.

Table 15.

SO8W – 8-lead plastic small outline, 208 mils body width, package data

Symbol

millimeters

inches(1)

Values in inches are converted from mm and rounded to 4 decimal digits.

Typ

Min

Max

Typ

Min

Max

2.5

0.0984

0.25

0.0098

1.51

0.0594

0.0787

0.4

0.35

0.51

0.0157

0.0138

0.0201

0.2

0.1

0.35

0.0079

0.0039

0.0138

0.1

0.0039

6.05

0.2382

5.02

6.22

0.1976

0.2449

7.62

8.89

0.3

0.35

1.27

0.05

0°

10°

0°

10°

0.5

0.8

0.0197

0.0315

N (number of pins)

6L_ME

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