FT201XQ-R datasheet(44/49 Pages) FTDI

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FT201X USB I2C SLAVE IC Datasheet

Version 1.4

Document No.: FT_000627 Clearance No.: FTDI# 264

11.5 Solder Reflow Profile

The FT201X is supplied in Pb free 16 LD SSOP and QFN-16 packages. The recommended solder reflow

profile for both package options is shown in Figure 11.5.

Figure 11.5 FT201X Solder Reflow Profile

The recommended values for the solder reflow profile are detailed in Table 11.1. Values are shown for

both a completely Pb free solder process (i.e. the FT201X is used with Pb free solder), and for a non-Pb

free solder process (i.e. the FT201X is used with non-Pb free solder).

Profile Feature

Pb Free Solder Process

Non-Pb Free Solder Process

Average Ramp Up Rate (Ts to Tp)

3°C / second Max.

3°C / Second Max.

Preheat

- Temperature Min (Ts Min.)

- Temperature Max (Ts Max.)

- Time (ts Min to ts Max)

150°C

200°C

60 to 120 seconds

100°C

150°C

60 to 120 seconds

Time Maintained Above Critical Temperature

TL:

- Temperature (TL)

- Time (tL)

217°C

60 to 150 seconds

183°C

60 to 150 seconds

Peak Temperature (Tp)

260°C

240°C

Time within 5°C of actual Peak Temperature

(tp)

20 to 40 seconds

Ramp Down Rate

6°C / second Max.

Time for T= 25°C to Peak Temperature, Tp

8 minutes Max.

6 minutes Max.

Table 11.1 Reflow Profile Parameter Values

Critical Zone: when

T is in the range

T to T

Time, t (seconds)

T = 25º C to T

Preheat

Ramp Up

Ramp

Down

T Max

T Min

FT201XQ-R Datasheet(PDF) 44 Page - Future Technology Devices International Ltd.

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