8.7 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

9 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision Q (September 2024) to Revision R (May 2025)

Page

• Added new silicon DBV thermals....................................................................................................................... 4

• Updated DRB (VSON) for DRB0008A package outline..................................................................................... 4

• Changed legacy chip to legacy silicon in Device Nomenclature table..............................................................27

Changes from Revision P (December 2015) to Revision Q (September 2024)

Page

• Updated the numbering format for tables, figures, and cross-references throughout the document................. 1

• Changed SON to VSON throughout document.................................................................................................. 1

• Added new silicon ground pin current spec........................................................................................................6

• Added new silicon shutdown current spec......................................................................................................... 6

• Added new silicon plots to Typical Characteristics ............................................................................................ 7

• Changed load current max source from 500mA to 250mA and dropout voltage from 250mV to 150mV in

Overview section.............................................................................................................................................. 16

• Changed total ESR drops below 50nΩF to total ESR drops below 50nF × Ω in Input and Output Capacitor

Requirements section.......................................................................................................................................21

• Added new silicon plots to Application Curves section.....................................................................................22

• Changed Layout Guidelines section.................................................................................................................23

• Added DBV and DCQ layout figures to Layout Examples section................................................................... 24

• Added M3 information to Device Nomenclature .............................................................................................. 27

10 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

TPS732

SBVS037R – AUGUST 2003 – REVISED MAY 2025

www.ti.com

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