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IS25LP256D-RJLE-TY Datasheet(PDF) 178 Page - Integrated Silicon Solution, Inc |
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IS25LP256D-RJLE-TY Datasheet(HTML) 178 Page - Integrated Silicon Solution, Inc |
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178 / 179 page  IS25LP256D IS25WP256D Integrated Silicon Solution, Inc.- www.issi.com 178 Rev A15 08/05/2024 11. ORDERING INFORMATION – Valid Part Numbers IS25LP 256 D - J M L E - TR PACKING TR = Tape and Reel TY = Tray Blank = Bulk TEMPERATURE RANGE E = Extended (-40°C to +105°C) A3 = Automotive Grade (-40°C to +125°C) PACKAGING CONTENT L = Halogen-free, RoHS & TSCA Compliant PACKAGE Type L = 8-contact WSON (8x6mm) J = 8-contact WSON (8x6mm), Pad Open = 3.4mmx4.3mm M = 16-pin SOIC 300mil G = 24-ball TFBGA 4x6 ball array H = 24-ball TFBGA 5x5 ball array W = KGD Option J = Standard R = Dedicated RESET# pin (or ball) Q = QE bit set to 1 P = Dedicated RESET# pin (or ball) + QE bit set to 1 Die Revision D = Revision D Density 256 = 256 Megabit BASE PART NUMBER IS = Integrated Silicon Solution Inc. 25LP = FLASH, 2.30V ~ 3.60V, QPI 25WP = FLASH, 1.65V ~ 1.95V, QPI |
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