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TLE2061MD Datasheet(PDF) 63 Page - Texas Instruments

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Part # TLE2061MD
Description  EXCALIBUR JFET-INPUT HIGH-OUTPUT-DRIVE uPOWER OPERATIONAL AMPLIFIERS
PDF  78 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TLE2061MD Datasheet(HTML) 63 Page - Texas Instruments

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Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
TLE2064CDR
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
Call TI
Level-1-260C-UNLIM
TLE2064CDRG4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
Call TI
Level-1-260C-UNLIM
TLE2064CN
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
TLE2064CNE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
TLE2064CNSR
OBSOLETE
SO
NS
14
TBD
Call TI
Call TI
TLE2064ID
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
Call TI
Level-1-260C-UNLIM
TLE2064IDG4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
Call TI
Level-1-260C-UNLIM
TLE2064IDR
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
Call TI
Level-1-260C-UNLIM
TLE2064IDRG4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
Call TI
Level-1-260C-UNLIM
TLE2064IN
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
TLE2064INE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
TLE2064MD
ACTIVE
SOIC
D
14
50
TBD
CU NIPDAU
Level-1-220C-UNLIM
TLE2064MDG4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLE2064MDR
ACTIVE
SOIC
D
14
2500
TBD
CU NIPDAU
Level-1-220C-UNLIM
TLE2064MDRG4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLE2064MFKB
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
TLE2064MJ
ACTIVE
CDIP
J
14
1
TBD
A42 SNPB
N / A for Pkg Type
TLE2064MJB
ACTIVE
CDIP
J
14
1
TBD
A42 SNPB
N / A for Pkg Type
TLE2064MN
OBSOLETE
PDIP
N
14
TBD
Call TI
Call TI
TLE2064MWB
ACTIVE
CFP
W
14
1
TBD
A42 SNPB
N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
PACKAGE OPTION ADDENDUM
www.ti.com
11-Oct-2007
Addendum-Page 5



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