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DP9502AB Datasheet(PDF) 7 Page - Shenzhen Developer Microelectronics Co., Ltd |
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DP9502AB Datasheet(HTML) 7 Page - Shenzhen Developer Microelectronics Co., Ltd |
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7 / 10 page ![]() www.publicxin.com Peng Jijun 13326967551 translated to English by Yevhen Stadnik 380972333363 7 DP950XB Non-Isolated, Step-Down Quasi-Resonant LED Power Switch Functional Description The DP950XB series is a highly integrated constant current LED power switch. The chip adopts a quasi-resonant working mode and does not require an auxiliary winding to detect demagnetization. The chip also integrates a 500V power switch and a high-voltage self-powered circuit. Only a few peripheral devices are required to achieve excellent constant current characteristics, and the system cost is extremely low. □ Power by HVDD DP950XB integrates a 650V high-voltage power supply circuit. The gate drive of the power MOSFET is directly powered by the high-voltage power supply circuit, and no external VDD capacitor is required. □ Constant current control The DP950XB series samples the inductor current cycle by cycle. When the inductor current reaches the current comparator threshold voltage (VCS_max=600mV), the power MOSFET is immediately turned off and the inductor enters the demagnetization state. When the inductor current demagnetization is completed, the next cycle is started. The system works in the inductor current critical mode, so the output constant current value is determined by the following formula: I mA 1 Vcs(max) 300mV □ Degaussing detection DP950XB uses an internal integrated demagnetization detection circuit, which does not require an auxiliary winding and greatly reduces system cost. □ Maximum and minimum shutdown time When the power MOSFET is turned off, the DP950XB is designed with a typical minimum off time limit of 1us to avoid interference. At the same time, the typical maximum off time inside the chip is designed to be 270us. □ Output Overvoltage Protection (OVP) The DP950XB output overvoltage protection can be adjusted through the resistor (ROVP) between the ROVP pin and the ground. The chip flows out IROVP=40uA current at the ROVP pin, which generates a voltage VROVP IROVP ROVP on the ROVP resistor. At the same time, the chip samples the CS peak voltage VCS_PK. VROVP and VCS_PK work together to generate an overvoltage protection time Tovp in each cycle. When the output is open, the output voltage will increase and the inductor demagnetization time Tdem will decrease. When Tdem is less than Tovp, the system will trigger the output OVP protection and enter the automatic restart state until the output is restored. The system will work normally. CC_OUT 2 R cs R cs Where: Rcs - The setup resistor connected between the CS pin and the GND pin. □ Current sampling and leading edge blanking At each moment when the power MOSFET is turned on, the voltage across the sampling resistor is compared with the internal overcurrent comparator to control the output current. However, at the moment when the MOSFET is turned on, a voltage spike caused by the parasitic capacitance of the MOSFET and the reverse recovery current of the freewheeling diode will also be generated. In order to avoid the wrong shutdown of the drive signal, the chip is designed with a leading edge blanking time. During this time (typical value 500ns), the internal PWM comparator stops working to ensure that the drive signal is stably turned on. During the shutdown process or when the input voltage is very low, the system will encounter the maximum on time, and VCS_PK and Tovp will decrease proportionally, which can avoid the false triggering of the output overvoltage protection. In a non-isolated buck system, the inductor demagnetization voltage is the output voltage. Therefore, the demagnetization time Tdem during overvoltage protection satisfies the following equation: L V CS_PK Where: T dem T ovp OVP R cs VCS_PK is the current peak sampling voltage, which is the overcurrent comparator reference voltage (600mV) during normal operation. VOVP is the overvoltage protection voltage value V |
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