ADIN1300BCPZ-R7 datasheet(13/96 Pages) AD

13 / 96 page

Data Sheet

ADIN1300

ABSOLUTE MAXIMUM RATINGS

analog.com

Rev. B | 13 of 96

TA = 25°C, unless otherwise noted.

Table 11.

Parameter

Rating

VDDIO to GND

−0.3 V to +3.63 V

DVDD_0P9 to GND

−0.3 V to +1.1 V

AVDD_3P3 to GND

−0.3 V to +3.63 V

MAC Interface to GND

−0.3 V to VDDIO + 0.3 V

LINK_ST, GP_CLK

−0.3 V to VDDIO + 0.3 V

MDIO, MDC, INT_N to GND

−0.3 V to +3.63 V

MDI_x_x to GND

−0.3 V to AVDD_3P3 +

0.3 V

LED_0, RESET_N, XTAL_I/CLK_IN/REF_CLK,

XTAL_O, CLK25_REF

−0.3 V to AVDD_3P3 +

0.3 V

Operating Temperature Range (TA)

Industrial

−40°C to +105°C

Storage Temperature Range

−65°C to +150°C

Junction Temperature (TJ Maximum)

125°C

Power Dissipation

(TJ maximum − TA)/θJA

Lead Temperature

JEDEC industry-standard

Soldering

J-STD-020

Electrostatic Discharge (ESD)

Human Body Model (HBM)

MDI_x_x Pins

4 kV

All Other Pins

2 kV

Machine Model (MM)

200 V

Field Induced Charged Device Model (FICDM)

1.25 kV

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Close attention to PCB

thermal design is required.

θJA is the natural convection junction to ambient thermal resistance

measured in a one cubic foot sealed enclosure.

θJC is the junction to case thermal resistance.

Table 12. Thermal Resistance

Package Type

θJA

θJC

Unit

CP-40-26

451

251

°C/W

302

°C/W

1 Based on simulated data using a JEDEC 2s2p thermal test board with a 3 × 3

array of thermal vias in a JEDEC natural convection environment. See JEDEC

specification JESD-51 for details.

2 Test Condition 1: thermal impedance measured on Analog Devices, Inc.,

hardware, 2S2P with 4 × 4 via array.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.

ADIN1300BCPZ-R7 Datasheet(PDF) 13 Page - Analog Devices

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