MPC8555VTAPF datasheet(70/88 Pages) FREESCALE

70 / 88 page

MPC8555E PowerQUICC™ III Integrated Communications Processor Hardware Specifications, Rev. 4

Freescale Semiconductor

Thermal

Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal

performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost. Several

heat sinks offered by Aavid Thermalloy, Alpha Novatech, IERC, Chip Coolers, Millennium Electronics,

and Wakefield Engineering offer different heat sink-to-ambient thermal resistances, that will allow the

MPC8555E to function in various environments.

16.2.1

Recommended Thermal Model

For system thermal modeling, the MPC8555E thermal model is shown in Figure 52. Five cuboids are used

to represent this device. To simplify the model, the solder balls and substrate are modeled as a single block

29x29x1.6 mm with the conductivity adjusted accordingly. The die is modeled as 8.7 x 9.3 mm at a

thickness of 0.75 mm. The bump/underfill layer is modeled as a collapsed resistance between the die and

substrate assuming a conductivity of 4.4 W/m•K in the thickness dimension of 0.07 mm. The lid attach

adhesive is also modeled as a collapsed resistance with dimensions of 8.7 x 9.3 x 0.05 mm and the

conductivity of 1.07 W/m•K. The nickel plated copper lid is modeled as 11 x 11 x 1 mm.

Figure 43. MPC8555E Thermal Model

Die

Lid

Substrate and solder balls

Heat Source

Substrate

Side View of Model (Not to Scale)

Top View of Model (Not to Scale)

Conductivity

Value

Unit

Lid

(11

× 11 × 1 mm)

360

W/(m

× K)

360

Lid Adhesive—Collapsed resistance

(8.7

× 9.3 × 0.05 mm)

1.07

Die

(8.7

× 9.3 × 0.75 mm)

Bump/Underfill—Collapsed resistance

(8.7

× 9.3 × 0.07 mm)

4.4

Substrate and Solder Balls

(25

× 25 × 1.6 mm)

14.2

1.2

Adhesive

Bump/underfill

MPC8555VTAPF Datasheet(PDF) 70 Page - Freescale Semiconductor, Inc

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