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SL2S3003FUD Datasheet(PDF) 8 Page - NXP Semiconductors |
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SL2S3003FUD Datasheet(HTML) 8 Page - NXP Semiconductors |
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8 / 82 page ![]() NXP Semiconductors SL2S3003/SL2S3003TT ICODE 3 (TagTamper) 6 Wafer layout not to scale! GND LA LB DP Figure 3. SL2S3003TTFUD wafer layout and pin configuration for the bare die 6.1 Pin description Symbol Description LA Antenna connection LA LB Antenna connection LB GND Ground (only connected to IC circuitry for SL2S3003TT) DP Detection pin (only connected to IC circuitry for SL2S3003TT) Table 2. Bonding pad description Refer to [5]. SL2S3003/SL2S3003TT All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved. Product data sheet Rev. 3.0 — 28 March 2024 8 / 82 |
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