AS7211 datasheet(29/37 Pages) OSRAM

Part #	AS7211

Description	Smart Daylighting Manager with Fully Integrated Daylight Sensor, Control and Network Interfaces

PDF	37 Pages

Scroll/Zoom	100%

Manufacturer	OSRAM [OSRAM GmbH]

Direct Link	http://www.osram.com

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29 / 37 page

Page 28

ams Datasheet

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[v1-00] 2016-Dec-23

AS7211 − Soldering, Manufacturing Process Considerations & Storage Information

Solder Reflow Profile

The module has been tested and has demonstrated an ability

to be reflow soldered to a PCB substrate. The solder reflow

profile describes the expected maximum heat exposure of

components during the solder reflow process of product on a

PCB. Temperature is measured on top of component. The

components should be limited to a maximum of three passes

through this solder reflow profile.

Figure 34:

Recommended Reflow Soldering Profile

Figure 35:

Solder Reflow Profile Graph

Profile Feature

Reference

Device

Average temperature gradient in preheating

2.5°C/s

Soak Time

tSOAK

2 to 3 minutes

Time above 217°C (T1)t1

Max 60s

Time above 230°C (T2)t2

Max 50s

Time above Tpeak - 10°C (T3)t3

Max 10s

Peak temperature in reflow

Tpeak

260°C

Temperature gradient in cooling

Max - 5°C/s

Soldering, Manufacturing

Process Considerations &

Storage Information

AS7211 Datasheet(PDF) 29 Page - OSRAM GmbH