Recommended Profile

Reflow profile for Sn96.5/Ag3.5 solder assembly, designed as a starting point for process optimization.

Application Notes

SMDAL solder paste uses a special stronger flux to break down the aluminum oxide layer when it is heated (activated). You

need to apply sufficient heat in a short enough amount of time to activate the flux in the solder paste, and then heat your

aluminum to 260°C to 300°C, and do that within 4 to 5 minutes. The solder paste itself needs to reach at least 249°C (as per

our recommended reflow profile) to fully melt, but you will usually need to heat your aluminum hotter than this. Also, make

sure to measure the temperature of the aluminum, and not the surrounding air. Heating the aluminum to 260°C to 300°C, or

even a little hotter will help the aluminum accept the solder and form a strong intermetallic bond with the Tin/Silver alloy in the

SMDAL solder paste.

The biggest factor in success in soldering to aluminum with the SMDAL is getting enough heat into the aluminum in a short

amount of time, before all the flux activity in the SMDAL is used up.

Test Results

Test J-STD-004 or other

requirements as stated

Test Requirement

Result

Viscosity – Malcom @ 10 RPM/25°C

(x103mPaꞏs)

IPC-TM-650: 2.4.34.4

300-500

Conflict Minerals Compliance

Electronic Industry Citizenship

Coalition (EICC)

Compliant

REACH Compliance

Articles 33 and 67 of Regulation (EC)

No 1907/2006

Contains no substance >0.1% w/w that

is listed as a SVHC or restricted for

use in solder materials

Conforms to the following Industry Standards:

J-STD-004B, Amendment 1 (Solder Fluxes):

Yes

J-STD-005A (Solder Pastes):

Yes

J-STD-006C, Amendments 1 & 2 (Solder Alloys and Fluxed/Non-Fluxed Solders):

Yes

RoHS 3 Directive (EU) 2015/863:

Yes

2

© 1994-2023 Chip Quik® Inc.

25°C (77°F)

0sec

150°C (302°F)

175°C (347°F)

221°C (430°F)

249°C (480°F)

90sec

180sec

210sec

240sec

270sec

Time

Temperature