| Electronic Components Datasheet Search |
|
SMDAL Datasheet(PDF) 1 Page - Chip Quik Inc. |
|
|
|||||||||||||||||||||||||||||
SMDAL Datasheet(HTML) 1 Page - Chip Quik Inc. |
|
1 / 2 page ![]() Datasheet revision 1.1 www.chipquik.com Aluminum Solder Paste Water-Soluble Sn96.5/Ag3.5 T3 (10g syringe) Product Highlights Used for soldering Aluminum to Aluminum, Aluminum to Copper, Aluminum to Brass, Aluminum to plated terminals Printing speeds up to 100mm/sec Long stencil life Wide process window Compatible with enclosed print heads RoHS 3 and REACH compliant Specifications Alloy: Sn96.5/Ag3.5 Mesh Size: T3 Micron (µm) Range: 25-45 Flux Type: Synthetic Water-Soluble Flux Classification: ROM1 (Water Soluble, Must be cleaned off post-use using Hot Water (60°C+) or IPA) Metal Load: 75% Metal by Weight Melting Point: 221°C (430°F) Packaging: 5cc/10g Syringe Shelf Life: Refrigerated >12 months, Unrefrigerated >6 months *See notes below: *Shelf Life Notes: Chip Quik® solder paste is good past its quoted shelf life, regardless of refrigeration. Before use, visually inspect the solder paste to ensure it is not dried out or clumpy, or check stencil release. If stored in a jar, stir the product thoroughly for 2-3 minutes before inspection and use. Chip Quik® solder paste is manufactured using Made in USA high quality synthetic flux and precision atomized metal powder. Chip Quik® solder paste is guaranteed for 12 months from date of manufacture, regardless of refrigeration. If you have any issues with our solder paste, please contact Chip Quik® directly for no charge warranty replacement. Please retain original bill of sale, and solder paste in original container as we may request its return for internal R&D testing purposes. Printer Operation Print Speed: 25-100mm/sec Squeegee Pressure: 70-250g/cm of blade Under Stencil Wipe: Once every 10-25 prints, or as necessary Stencil Life >12 hours @ 20-50% RH 22-28°C (72-82°F) >4 hours @ 50-70% RH 22-28°C (72-82°F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Refrigerate at 3-8°C (37-46°F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25°C (68-77°F) before use. Transportation This product has no shipping restrictions. Shipping below 0°C (32°F) or above 25°C (77°F) for normal transit times by ground or air will not impact this product’s stated shelf life. 1 © 1994-2023 Chip Quik® Inc. S SM MD DA AL L |
Similar Part No. - SMDAL |
|
Similar Description - SMDAL |
|
|
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |