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FN2974.3

December 6, 2005

Die Characteristics

DIE DIMENSIONS:

66.1 x 70.5 x 19

± 1mils

METALLIZATION:

Type: Si - AI

Thickness: 11k

GLASSIVATION:

Thickness: 8k

WORST CASE CURRENT DENSITY:

Metallization Mask Layout

82C84A

AEN1

PCLK

CSYNC

X1

RDY1

READY

RDY2

AEN2

CLK

GND

RESET

RES

OSC

X2

ASYNC

EFI

F/C

82C84A

82C84A