Nexperia

BAS116LS-Q

Low-leakage diode

13. Soldering

SOD882BD

Footprint information for reflow soldering of DFN1006BD-2 package

sod882bd_fr

solder paste

solder resist

solder lands

Dimensions in mm

Issue date 20-05-01

20-12-15

1.4

0.2

0.3

0.4

1.0

1.3

0.8

(2×)

0.6

(2×)

0.7

(2×)

Fig. 9. Reflow soldering footprint for DFN1006BD-2 (SOD882BD)

BAS116LS-Q

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Product data sheet

3 January 2022

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