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MFS8610BMDA0ES Datasheet(PDF) 4 Page - NXP Semiconductors |
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MFS8610BMDA0ES Datasheet(HTML) 4 Page - NXP Semiconductors |
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4 / 16 page ![]() NXP Semiconductors FS8600_SDS Fail-safe system basis chip with multiple SMPSs and LDOs 5 Ordering information 5.1 Device family The FS8600 device family (called FS86 hereafter) provides selectable features based on part numbering and OTP configuration. FS + Core ID Application VSUP max rating VPRE BOOST BUCK LDOs VMONs Watchdog FCCU ERRMON FIN FS8600 60 V Yes Yes No 2 4[1] Yes Yes Yes FS8601 60 V Yes Yes No 2 6[1] Yes Yes Yes FS8602 60 V Yes Yes No 2 8[1] Yes Yes Yes FS8603 60 V Yes Yes No 2 10[1] Yes Yes No[3] FS8610 60 V Yes Yes Yes 2 4[1] Yes Yes Yes FS8611 60 V Yes Yes Yes 2 6[1] Yes Yes Yes FS8612 60 V Yes Yes Yes 2 8[1] Yes Yes Yes FS8613 24 V battery network 60 V Yes Yes Yes 2 10[1] Yes Yes No[3] FS8620 36 V Yes Yes No 2 4[1] Yes Yes Yes FS8621 36 V Yes Yes No 2 6[1] Yes Yes Yes FS8622 36 V Yes Yes No 2 8[1] Yes Yes Yes FS8623 36 V Yes Yes No 2 10[1] Yes Yes No[3] FS8630 36 V Yes Yes Yes 2 4[1] Yes Yes Yes FS8631 36 V Yes Yes Yes 2 6[1] Yes Yes Yes FS8632 36 V Yes Yes Yes 2 8[1] Yes Yes Yes FS8633 12 V battery network 36 V Yes Yes Yes 2 10[1] Yes[2] Yes Yes No[3] Table 1. Device options [1] Maximum number allowed. Any VMONx can be enabled up to this limit. [2] ASIL B: watchdog simple. ASIL D: watchdog challenger. [3] FIN and VMON9 cannot be used at the same time (same pin) 5.2 Part numbering M FS 8600 B M B A0 ES P: prototype M: standard S: custom HV PMIC FS86 Core ID[1] Silicon revision A: A0 B: A1 Ambient temperature (TA) M: –40 °C to 125 °C ASIL B: ASIL B D: ASIL D OTP code A0: OTP A0 xx: OTP xx Package type ES: dimple wettable flank [1] See Table 1 Package Part Number[1] Application ASIL Name Description Version MFS8600BMBA0ES[2] MFS8601BMBA0ES[2] MFS8602BMBA0ES[2] MFS8603BMBA0ES[2] 24 V battery network B HPQFN48eP HPQFN48, plastic, thermally enhanced very thin quad flat package, no lead, wettable flanks SOT619-26 Table 2. Ordering information FS8600_SDS All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved. Product short data sheet Rev. 2.0 — 7 December 2022 4 / 16 |
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