HI-SINCERITY

MICROELECTRONICS CORP.

Spec. No. : HT200101

Issued Date : 2000.05.01

Revised Date : 2005.12.02

Page No. : 4/5

HT112

HSMC Product Specification

TO-126 Dimension

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.

• HSMC reserves the right to make changes to its products without notice.

• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

Head Office And Factory:

• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.

Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454

• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C

Tel: 886-3-5983621~5 Fax: 886-3-5982931

Marking:

Control Code

Date Code

HT

11 2

Pb Free Mark

Pb-Free: "

Normal: None

Note: Green label is used for pb-free packing

Pin Style: 1.Emitter 2.Collector 3.Base

Material:

• Lead solder plating: Sn60/Pb40 (Normal),

Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)

• Mold Compound: Epoxy resin family,

flammability solid burning class: UL94V-0

3-Lead TO-126

Plastic Package

HSMC Package Code: T

DIM

Min.

Max.

A

3.60

4.40

B

6.90

7.60

C

13.00

16.50

D

7.20

8.50

F

0.65

0.88

G

1.00

1.42

H

4.52

4.62

J

1.14

1.50

K

0.90

1.50

L

0.45

0.60

M

2.92

3.40

N

2.00

2.70

Unit: mm

A

12

3

D

C

H

F

G

L

J

K

M

N

B