ADPA7006CHIP datasheet(17/24 Pages) AD

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Data Sheet

ADPA7006CHIP

Rev. 0 | Page 17 of 24

MMIC

PCB

50Ω

TRANSMISSION LINE

MATCHING STUB/BONDPAD

SHUNT CAPACITANCE = 15fF

3mil GAP

RFOUT

3mil GOLD

RIBBON

Figure 53. High Frequency Output Wideband Matching

Handling Precautions

To avoid permanent damage, follow these storage, cleanliness,

static sensitivity, transient, and general handling precautions:



Place all bare die in either waffle or gel-based ESD

protective containers and then seal the die in an ESD

protective bag for shipment. After the sealed ESD

protective bag is opened, store all die in a dry nitrogen

environment.



Handle the chips in a clean environment. Do not attempt

to clean the chip using liquid cleaning systems.



Follow ESD precautions to protect against ESD strikes.



While bias is applied, suppress instrument and bias supply

transients. Use shielded signal and bias cables to minimize

inductive pickup.



Handle the chip along the edges with a vacuum collet or

with a sharp pair of tweezers. The surface of the chip has

fragile air bridges and must not be touched with a vacuum

collet, tweezers, or fingers.

Mounting

Before the epoxy die is attached, apply a minimum amount of

epoxy to the mounting surface so that a thin epoxy fillet is

observed around the perimeter of the chip after it is placed into

position. Cure the epoxy per the schedule of the manufacturer.

Wire Bonding

RF bonds made with 3 mil × 0.5 mil gold ribbon are recommended

for the RF ports. These bonds must be thermosonically bonded

with a force of 40 g to 60 g. Thermosonically bonded dc bonds

of 0.025 mm diameter, are recommended. Create ball bonds with a

force of 40 g to 50 g and wedge bonds with a force of 18 g to 22 g.

Create all bonds with a nominal stage temperature of 150°C.

Apply a minimum amount of ultrasonic energy to achieve reliable

bonds. Keep all bonds as short as possible, less than 0.31 mm.

Alternatively, short RF bonds that are ≤3 mm and made with

two 1 mm wires can be used.

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