STM32F091VCU6TP datasheet(54/128 Pages) STMICROELECTRONICS

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Electrical characteristics

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6.3

Operating conditions

6.3.1

General operating conditions

6.3.2

Operating conditions at power-up / power-down

The parameters given in Table 25 are derived from tests performed under the ambient

temperature condition summarized in Table 24.

Table 24. General operating conditions

Symbol

Parameter

Conditions

Min

Max

Unit

fHCLK

Internal AHB clock frequency

MHz

fPCLK

Internal APB clock frequency

VDD

Standard operating voltage

2.0

3.6

VDDIO2

I/O supply voltage

Must not be supplied if VDD

is not present

1.65

3.6

VDDA

Analog operating voltage

(ADC and DAC not used)

Must have a potential equal

to or higher than VDD

VDD

3.6

Analog operating voltage

(ADC and DAC used)

2.4

3.6

VBAT

Backup operating voltage

1.65

3.6

VIN

I/O input voltage

TC and RST I/O

-0.3

VDDIOx+0.3

TTa I/O

-0.3

VDDA+0.3(1)

FT and FTf I/O

-0.3

5.5(1)

Power dissipation at TA = 85 °C

for suffix 6 or TA = 105 °C for

suffix 7(2)

UFBGA100

364

LQFP100

476

LQFP64

455

WLCSP64

377

UFBGA64

308

LQFP48

370

UFQFPN48

625

Ambient temperature for the

suffix 6 version

Maximum power dissipation

–40

°C

Low power dissipation(3)

–40

105

Ambient temperature for the

suffix 7 version

Maximum power dissipation

–40

105

°C

Low power dissipation(3)

–40

125

Junction temperature range

Suffix 6 version

–40

105

°C

Suffix 7 version

–40

125

1. For operation with a voltage higher than VDDIOx + 0.3 V, the internal pull-up resistor must be disabled.

2. If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax. See Section 7.8: Thermal characteristics

3. In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax (see Section 7.8:

Thermal characteristics

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