FPD200 datasheet(2/2 Pages) FILTRONIC

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FPD200

GENERAL PURPOSE PHEMT

Phone: +1 408 850-5790

http://www.filtronic.co.uk/semis

Revised: 11/17/04

Fax: +1 408 850-5766

Email: sales@filcsi.com

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ABSOLUTE MAXIMUM RATINGS1

Parameter

Symbol

Test Conditions

Min

Max

Units

Drain-Source Voltage

VDS

-3V < VGS < +0V

Gate-Source Voltage

VGS

0V < VDS < +8V

-3

Drain-Source Current

IDS

For VDS > 2V

IDSS

Gate Current

Forward or reverse current

RF Input Power2

Under any acceptable bias state

100

Channel Operating Temperature

TCH

Under any acceptable bias state

175

ºC

Storage Temperature

TSTG

Non-Operating Storage

-40

150

ºC

Total Power Dissipation

PTOT

See De-Rating Note below

0.5

Gain Compression

Comp.

Under any bias conditions

Simultaneous Combination of Limits3

2 or more Max. Limits

1TAmbient = 22°C unless otherwise noted

2Max. RF Input Limit must be further limited if input VSWR > 2.5:1

3Users should avoid exceeding 80% of 2 or more Limits simultaneously

Notes:

•

Operating conditions that exceed the Absolute Maximum Ratings could result in permanent damage to the device.

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Thermal Resitivity specification assumes a Au/Sn eutectic die attach onto a Au-plated copper heatsink or rib.

•

Power Dissipation defined as: PTOT ≡ (PDC + PIN) – POUT, where

PDC: DC Bias Power

PIN: RF Input Power

POUT: RF Output Power

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Absolute Maximum Power Dissipation to be de-rated as follows above 22

°C:

PTOT= 500mW – (3.6mW/°C) x THS

where THS = heatsink or ambient temperature.

Example: For a 85

°C heatsink temperature: PTOT = 0.5W – (0.0036 x (85 – 22)) = 0.27W

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HANDLING PRECAUTIONS

To avoid damage to the devices care should be exercised during handling. Proper Electrostatic

Discharge (ESD) precautions should be observed at all stages of storage, handling, assembly, and

testing. These devices should be treated as Class 1A per ESD-STM5.1-1998, Human Body Model.

Further information on ESD control measures can be found in MIL-STD-1686 and MIL-HDBK-263.

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ASSEMBLY INSTRUCTIONS

The recommended die attach is gold/tin eutectic solder under a nitrogen atmosphere.

Stage

temperature should be 280-290

°C; maximum time at temperature is one minute. The recommended

wire bond method is thermo-compression wedge bonding with 0.7 or 1.0 mil (0.018 or 0.025 mm)

gold wire. Stage temperature should be 250-260

°C.

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APPLICATIONS NOTES & DESIGN DATA

Applications Notes are available from your local Filtronic Sales Representative or directly from the

factory. Complete design data, including S-parameters, noise data, and large-signal models are

available on the Filtronic web site.

All information and specifications are subject to change without notice.

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