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TLV9001UIDBVR Datasheet(PDF) 76 Page - Texas Instruments |
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TLV9001UIDBVR Datasheet(HTML) 76 Page - Texas Instruments |
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76 / 82 page ![]() www.ti.com PACKAGE OUTLINE C SEE OPTIONAL TERMINAL 8X 0.32 0.18 1.6 0.1 2X 1.5 0.9 0.1 6X 0.5 8X 0.4 0.2 0.05 0.00 0.8 MAX A 2.1 1.9 B 2.1 1.9 0.32 0.18 0.4 0.2 (0.2) TYP WSON - 0.8 mm max height DSG0008A PLASTIC SMALL OUTLINE - NO LEAD 4218900/C 04/2019 PIN 1 INDEX AREA SEATING PLANE 0.08 C 1 4 5 8 PIN 1 ID 0.1 C A B 0.05 C THERMAL PAD EXPOSED 9 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SCALE 5.500 OPTIONAL TERMINAL TYPICAL |
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