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TLV9001UIDBVR Datasheet(PDF) 39 Page - Texas Instruments

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Part # TLV9001UIDBVR
Description  TLV900x Low-Power, RRIO, 1-MHz Operational Amplifier for Cost-Sensitive Systems
PDF  82 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TLV9001UIDBVR Datasheet(HTML) 39 Page - Texas Instruments

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Device
Package
Type
Package
Drawing
Pins
SPQ
Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
TLV9004IRTER
WQFN
RTE
16
3000
330.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
TLV9004IRUCR
QFN
RUC
14
3000
180.0
9.5
2.16
2.16
0.5
4.0
8.0
Q2
TLV9004SIRTER
WQFN
RTE
16
3000
330.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TLV9001IDBVR
SOT-23
DBV
5
3000
210.0
185.0
35.0
TLV9001IDCKR
SC70
DCK
5
3000
190.0
190.0
30.0
TLV9001IDPWR
X2SON
DPW
5
3000
205.0
200.0
33.0
TLV9001SIDBVR
SOT-23
DBV
6
3000
210.0
185.0
35.0
TLV9001TIDCKR
SC70
DCK
5
3000
190.0
190.0
30.0
TLV9001UIDBVR
SOT-23
DBV
5
3000
210.0
185.0
35.0
TLV9002IDDFR
SOT-23-THIN
DDF
8
3000
210.0
185.0
35.0
TLV9002IDGKR
VSSOP
DGK
8
2500
366.0
364.0
50.0
TLV9002IDGKT
VSSOP
DGK
8
250
366.0
364.0
50.0
TLV9002IDR
SOIC
D
8
2500
336.6
336.6
41.3
TLV9002IDSGR
WSON
DSG
8
3000
210.0
185.0
35.0
TLV9002IDSGT
WSON
DSG
8
250
210.0
185.0
35.0
TLV9002IPWR
TSSOP
PW
8
2000
366.0
364.0
50.0
TLV9002SIDGSR
VSSOP
DGS
10
2500
366.0
364.0
50.0
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Jan-2020
Pack Materials-Page 2



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