OrderableDevice datasheet(13/76 Pages) TI1

13 / 76 page

TLV9051, TLV9052, TLV9054

www.ti.com

SBOS942F – AUGUST 2018 – REVISED JUNE 2019

Product Folder Links: TLV9051 TLV9052 TLV9054

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(1)

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7.5 Thermal Information for Dual Channel

THERMAL METRIC(1)

TLV9052, TLV9052S

UNIT

(SOIC)

DGK

(VSSOP)

DSG

(WSON)

(TSSOP)

DDF

(SOT-23)(2)

DGS

(VSSOP)

RUG

(X2QFN)

8 PINS

10 PINS

RθJA

Junction-to-ambient

thermal resistance

155.4

208.8

102.3

205.1

184.4

170.4

197.2

°C/W

RθJC(top)

Junction-to-case(top)

thermal resistance

95.5

93.3

120.0

93.7

112.8

84.9

93.3

°C/W

RθJB

Junction-to-board thermal

resistance

98.9

130.7

68.2

135.7

99.9

113.5

123.8

°C/W

ψJT

Junction-to-top

characterization

parameter

41.9

26.1

15.1

25.0

18.7

16.4

3.7

°C/W

ψJB

Junction-to-board

characterization

parameter

98.1

128.9

68.2

134.0

99.3

112.3

120.2

°C/W

RθJC(bot)

Junction-to-case(bottom)

thermal resistance

N/A

43.6

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.6 Thermal Information for Quad Channel

THERMAL METRIC(1)

TLV9054, TLV9054S

UNIT

D (SOIC)

PW (TSSOP)

RTE (WQFN)

RUC (X2SQFN)

14 PINS

16 PINS

14 PINS

RθJA

Junction-to-ambient thermal

resistance

115.0

147.2

65.5

65.6

209.4

°C/W

RθJC(top)

Junction-to-case(top) thermal

resistance

71.1

67.2

70.6

68.8

°C/W

RθJB

Junction-to-board thermal resistance

71.0

91.6

40.5

153.3

°C/W

ψJT

Junction-to-top characterization

parameter

29.7

16.6

5.8

3.0

°C/W

ψJB

Junction-to-board characterization

parameter

70.6

90.7

40.5

152.8

°C/W

RθJC(bot)

Junction-to-case(bottom) thermal

resistance

N/A

24.5

N/A

°C/W

OrderableDevice Datasheet(PDF) 13 Page - Texas Instruments

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