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TLV9001UIDBVR Datasheet(PDF) 4 Page - Texas Instruments |
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TLV9001UIDBVR Datasheet(HTML) 4 Page - Texas Instruments |
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4 / 81 page  4 TLV9001, TLV9002, TLV9004 SBOS833L – OCTOBER 2017 – REVISED MAY 2019 www.ti.com Product Folder Links: TLV9001 TLV9002 TLV9004 Submit Documentation Feedback Copyright © 2017–2019, Texas Instruments Incorporated Changes from Revision B (March 2018) to Revision C Page • Added TLV9002 16-pin TSSOP package to Device Information table................................................................................... 1 • Added TLV9002 10-pin X2QFN package to Device Information table................................................................................... 1 • Added TLV9002S DGS package pinout drawing in Pin Configurations and Functions section............................................. 9 • Added TLV9004 pinout diagram and pin configuration table to Pin Configuration and Functions section ......................... 10 • Added TLV9004S pinout diagram and pin configuration table to Pin Configuration and Functions section ....................... 12 • Changed TLV9002 D (SOIC) junction-to-ambient thermal resistance value from 147.4°C/W to 207.9°C/W ...................... 14 • Changed TLV9002 D (SOIC) junction-to-case (top) thermal resistance from 94.3°C/W to 92.8°C/W................................. 14 • Changed TLV9002 D (SOIC) junction-to-board thermal resistance from 89.5°C/W to 129.7°C/W...................................... 14 • Changed TLV9002 D (SOIC) junction-to-top characterization parameter from 47.3°C/W to 26°C/W ................................. 14 • Changed TLV9002 D (SOIC) junction-to-board characterization parameter from 89°C/W to 127.9°C/W ........................... 14 • Added DGK (VSSOP) thermal information to Thermal Information: TLV9002 table ........................................................... 14 • Added TLV9002 PW (TSSOP) thermal information to Thermal Information: TLV9002 table .............................................. 14 • Added PW (TSSOP) thermal information to Thermal Information: TLV9002 table ............................................................. 15 Changes from Revision A (December 2017) to Revision B Page • Added package preview notes to TLV9001 packages, TLV9004 packages, and TLV9002 8-pin VSSOP package in Device Information table ........................................................................................................................................................ 1 • Added package preview notes to TLV9001, TLV9004 and TLV9002 VSSOP package pinout drawings in Pin Configuration and Functions section ..................................................................................................................................... 6 • Deleted package preview note from TLV9002 DSG (WSON) pinout drawing in Pin Configurations and Functions section. 8 • Deleted package preview note from TLV9002 RUG (X2QFN) pinout drawing in Pin Configurations and Functions section 9 • Added DSG (WSON) package thermal information to the Thermal Information: TLV9002 table ........................................ 14 • Deleted package preview note from DSG (WSON) package in Thermal Information: TLV9002 table ................................ 14 • Added D (SOIC) package thermal information to the Thermal Information: TLV9004 table................................................ 15 Changes from Original (October 2017) to Revision A Page • Changed device status from Advance Information to Production Data/Mixed Status............................................................ 1 |
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