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TLV9001UIDBVR Datasheet(PDF) 2 Page - Texas Instruments

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Part # TLV9001UIDBVR
Description  Low-Power, RRIO, 1-MHz Operational Amplifier for Cost-Sensitive Systems
PDF  81 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TLV9001UIDBVR Datasheet(HTML) 2 Page - Texas Instruments

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TLV9001, TLV9002, TLV9004
SBOS833L – OCTOBER 2017 – REVISED MAY 2019
www.ti.com
Product Folder Links: TLV9001 TLV9002 TLV9004
Submit Documentation Feedback
Copyright © 2017–2019, Texas Instruments Incorporated
Table of Contents
1
Features .................................................................. 1
2
Applications ........................................................... 1
3
Description ............................................................. 1
4
Revision History..................................................... 2
5
Device Comparison Table..................................... 5
6
Pin Configuration and Functions ......................... 6
7
Specifications....................................................... 13
7.1
Absolute Maximum Ratings .................................... 13
7.2
ESD Ratings............................................................ 13
7.3
Recommended Operating Conditions ..................... 13
7.4
Thermal Information: TLV9001 ............................... 14
7.5
Thermal Information: TLV9001S ............................. 14
7.6
Thermal Information: TLV9002 ............................... 14
7.7
Thermal Information: TLV9002S ............................. 14
7.8
Thermal Information: TLV9004 ............................... 15
7.9
Thermal Information: TLV9004S ............................. 15
7.10
Electrical Characteristics....................................... 16
7.11
Typical Characteristics .......................................... 18
8
Detailed Description ............................................ 24
8.1
Overview ................................................................. 24
8.2
Functional Block Diagram ....................................... 24
8.3
Feature Description................................................. 25
8.4
Device Functional Modes........................................ 26
9
Application and Implementation ........................ 27
9.1
Application Information............................................ 27
9.2
Typical Application .................................................. 27
10
Power Supply Recommendations ..................... 32
10.1
Input and ESD Protection ..................................... 32
11
Layout................................................................... 33
11.1
Layout Guidelines ................................................. 33
11.2
Layout Example .................................................... 33
12
Device and Documentation Support ................. 34
12.1
Documentation Support ........................................ 34
12.2
Related Links ........................................................ 34
12.3
Receiving Notification of Documentation Updates 34
12.4
Community Resources.......................................... 34
12.5
Trademarks ........................................................... 34
12.6
Electrostatic Discharge Caution ............................ 34
12.7
Glossary ................................................................ 34
13
Mechanical, Packaging, and Orderable
Information ........................................................... 34
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision K (March 2019) to Revision L
Page
•
Added SOT-23 (8) information to Device Information table ................................................................................................... 1
•
Added SOT-23 DDF package to Device Comparison Table ................................................................................................. 5
•
Added SOT-23 (DDF) to Pin Configuration and Functions section........................................................................................ 8
•
Added DDF (SOT-23) Thermal Information: TLV9002 table ................................................................................................ 14
Changes from Revision J (January 2019) to Revision K
Page
•
Changed TLV9002S ESD Ratings heading to include all TLV9002S packages.................................................................. 13
•
Deleted preview notation from TLV9002SIRUG in Thermal Information table..................................................................... 14
Changes from Revision I (November 2018) to Revision J
Page
•
Deleted preview notation for TLV9002SIRUGR ..................................................................................................................... 1
•
Changed TLV9004 WQFN(14) package designator to X2QFN(14) package designator ...................................................... 1
•
Added RUG package to Device Comparison Table .............................................................................................................. 5
•
Added DGS package to Device Comparison Table .............................................................................................................. 5
•
Added shutdown devices to Device Comparison Table ........................................................................................................ 5
•
Changed TLV9001 DRL package pinout drawing .................................................................................................................. 6
•
Changed TLV9001 DRL package pin functions ..................................................................................................................... 6
•
Deleted package preview note from TLV9002SIRUGR (X2QFN) pinout drawing ................................................................. 9
•
Added TLV9004IRUC Thermal Information.......................................................................................................................... 15
•
Changed legend of Closed-Loop Gain vs Frequency plot ................................................................................................... 18



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