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TLV9001, TLV9002, TLV9004

www.ti.com

SBOS833H – OCTOBER 2017 – REVISED OCTOBER 2018

Product Folder Links: TLV9001 TLV9002 TLV9004

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Copyright © 2017–2018, Texas Instruments Incorporated

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Added TLV9001S 6-pin SOT-23 package to Pin Configuration and Functions section ......................................................... 7

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Added TLV9004 RTE pinout information to Pin Configuration and Functions section ........................................................ 10

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Added DPW (X2SON) and DRL (SOT-553) packages to Thermal Information: TLV9001 table ......................................... 14

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Added Thermal Information: TLV9001S table to Specifications section .............................................................................. 14

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Added RUG (X2QFN) package to Thermal Information: TLV9002 table ............................................................................. 14

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Added RTE (WQFN) and RUC (WQFN) packages to Thermal Information: TLV9004 table............................................... 15

Changes from Revision C (May 2018) to Revision D

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Added shutdown text to Description section .......................................................................................................................... 1

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Added TLV9002S and TLV9004S devices to Device Information table................................................................................. 1

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Added TLV9002S 10-pin X2QFN package to Device Information table ................................................................................ 1

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Added TLV9002S DGS package pinout information to Pin Configurations and Functions section ....................................... 8

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Added Thermal Information: TLV9001 table to Specifications section................................................................................. 14

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Added Thermal Information: TLV9004 table to Specifications section................................................................................. 15

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Added Shutdown section ...................................................................................................................................................... 25

Changes from Revision B (March 2018) to Revision C

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Added TLV9002 16-pin TSSOP package to Device Information table................................................................................... 1

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Added TLV9002 10-pin X2QFN package to Device Information table................................................................................... 1

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Added TLV9002S DGS package pinout drawing in Pin Configurations and Functions section............................................. 9

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Added TLV9004 pinout diagram and pin configuration table to Pin Configuration and Functions section ......................... 10

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Added TLV9004S pinout diagram and pin configuration table to Pin Configuration and Functions section ....................... 12

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Changed TLV9002 D (SOIC) junction-to-ambient thermal resistance value from 147.4°C/W to 207.9°C/W ...................... 14

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Changed TLV9002 D (SOIC) junction-to-case (top) thermal resistance from 94.3°C/W to 92.8°C/W................................. 14

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Changed TLV9002 D (SOIC) junction-to-board thermal resistance from 89.5°C/W to 129.7°C/W...................................... 14

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Changed TLV9002 D (SOIC) junction-to-top characterization parameter from 47.3°C/W to 26°C/W ................................. 14

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Changed TLV9002 D (SOIC) junction-to-board characterization parameter from 89°C/W to 127.9°C/W ........................... 14

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Added DGK (VSSOP) thermal information to Thermal Information: TLV9002 table ........................................................... 14

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Added TLV9002 PW (TSSOP) thermal information to Thermal Information: TLV9002 table .............................................. 14

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Added PW (TSSOP) thermal information to Thermal Information: TLV9002 table ............................................................. 15

Changes from Revision A (December 2017) to Revision B

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Added package preview notes to TLV9001 packages, TLV9004 packages, and TLV9002 8-pin VSSOP package in

Device Information table ........................................................................................................................................................ 1

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Added package preview notes to TLV9001, TLV9004 and TLV9002 VSSOP package pinout drawings in Pin

Configuration and Functions section ..................................................................................................................................... 6

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Deleted package preview note from TLV9002 DSG (WSON) pinout drawing in Pin Configurations and Functions section. 8

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Deleted package preview note from TLV9002 RUG (X2QFN) pinout drawing in Pin Configurations and Functions section 9

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Added DSG (WSON) package thermal information to the Thermal Information: TLV9002 table ........................................ 14

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Deleted package preview note from DSG (WSON) package in Thermal Information: TLV9002 table ................................ 14

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Added D (SOIC) package thermal information to the Thermal Information: TLV9004 table................................................ 15