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TLV9001, TLV9002, TLV9004

SBOS833H – OCTOBER 2017 – REVISED OCTOBER 2018

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Product Folder Links: TLV9001 TLV9002 TLV9004

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Copyright © 2017–2018, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Device Comparison Table..................................... 5

6

Pin Configuration and Functions ......................... 6

7

Specifications....................................................... 13

7.1

Absolute Maximum Ratings .................................... 13

7.2

ESD Ratings............................................................ 13

7.3

Recommended Operating Conditions ..................... 13

7.4

Thermal Information: TLV9001 ............................... 14

7.5

Thermal Information: TLV9001S ............................. 14

7.6

Thermal Information: TLV9002 ............................... 14

7.7

Thermal Information: TLV9002S ............................. 14

7.8

Thermal Information: TLV9004 ............................... 15

7.9

Thermal Information: TLV9004S ............................. 15

7.10

Electrical Characteristics....................................... 16

7.11

Typical Characteristics .......................................... 18

8

Detailed Description ............................................ 24

8.1

Overview ................................................................. 24

8.2

Functional Block Diagram ....................................... 24

8.3

Feature Description................................................. 25

8.4

Device Functional Modes........................................ 26

9

Application and Implementation ........................ 27

9.1

Application Information............................................ 27

9.2

Typical Application ................................................. 27

10

Power Supply Recommendations ..................... 32

10.1

Input and ESD Protection ..................................... 32

11

Layout................................................................... 33

11.1

Layout Guidelines ................................................. 33

11.2

Layout Example .................................................... 33

12

Device and Documentation Support ................. 34

12.1

Documentation Support ........................................ 34

12.2

Related Links ........................................................ 34

12.3

Receiving Notification of Documentation Updates 34

12.4

Community Resources.......................................... 34

12.5

Trademarks ........................................................... 34

12.6

Electrostatic Discharge Caution ............................ 34

12.7

Glossary ................................................................ 34

13

Mechanical, Packaging, and Orderable

Information ........................................................... 34

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision G (September 2018) to Revision H

Page

•

Changed From: TLV9001 DCK Package To: TLV9001T DCK Package ............................................................................... 6

Changes from Revision F (August 2018) to Revision G

Page

•

Added Device Comparison Table........................................................................................................................................... 5

•

Changed pin names for all devices and all packages ............................................................................................................ 6

•

Changed pin names and I/O designation on some TLV9001 pins ........................................................................................ 6

•

Changed the pin number for V+ in the SOIC, TSSOP column of the Pin Functions: TLV9004 table.................................. 11

Changes from Revision E (July 2018) to Revision F

Page

•

Added Scalabe CMOS Amplifier for Low-Cost Applications feature ...................................................................................... 1

•

Deleted PREVIEW designation on TLV9002 and TLV9004 devices with the TSSOP package. .......................................... 1

•

Added TLV9001U DBV (SOT-23) pinout drawing to Pin Configuration and Functions section ............................................ 6

•

Added SOT-23 U Pinout to Pin Functions section ................................................................................................................ 6

Changes from Revision D (June 2018) to Revision E

Page

•

Corrected typo in Description section .................................................................................................................................... 1

•

Added TLV9001 5-pin X2SON package to Device Information table .................................................................................... 1

•

Added TLV9001S 6-pin SOT-23 package to Device Information table.................................................................................. 1

•

Added TLV9004 14-pin and 16-pin WQFN packages to Device Information table ............................................................... 1

•

Added TLV9001 DPW (X2SON) pinout drawing to Pin Configuration and Functions section ............................................... 6