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TLV9001, TLV9001S, TLV9002, TLV9002S, TLV9004, TLV9004S

SBOS833G – OCTOBER 2017 – REVISED SEPTEMBER 2018

www.ti.com

Product Folder Links: TLV9001 TLV9001S TLV9002 TLV9002S TLV9004 TLV9004S

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Copyright © 2017–2018, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Device Comparison Table..................................... 4

6

Pin Configuration and Functions ......................... 5

7

Specifications....................................................... 12

7.1

Absolute Maximum Ratings .................................... 12

7.2

ESD Ratings............................................................ 12

7.3

Recommended Operating Conditions ..................... 12

7.4

Thermal Information: TLV9001 ............................... 13

7.5

Thermal Information: TLV9001S ............................. 13

7.6

Thermal Information: TLV9002 ............................... 13

7.7

Thermal Information: TLV9002S ............................. 13

7.8

Thermal Information: TLV9004 ............................... 14

7.9

Thermal Information: TLV9004S ............................. 14

7.10

Electrical Characteristics....................................... 15

7.11

Typical Characteristics .......................................... 17

8

Detailed Description ............................................ 23

8.1

Overview ................................................................. 23

8.2

Functional Block Diagram ....................................... 23

8.3

Feature Description................................................. 24

8.4

Device Functional Modes........................................ 25

9

Application and Implementation ........................ 26

9.1

Application Information............................................ 26

9.2

Typical Application ................................................. 26

10

Power Supply Recommendations ..................... 31

10.1

Input and ESD Protection ..................................... 31

11

Layout................................................................... 32

11.1

Layout Guidelines ................................................. 32

11.2

Layout Example .................................................... 32

12

Device and Documentation Support ................. 33

12.1

Documentation Support ........................................ 33

12.2

Related Links ........................................................ 33

12.3

Receiving Notification of Documentation Updates 33

12.4

Community Resources.......................................... 33

12.5

Trademarks ........................................................... 33

12.6

Electrostatic Discharge Caution ............................ 33

12.7

Glossary ................................................................ 33

13

Mechanical, Packaging, and Orderable

Information ........................................................... 33

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision F (August 2018) to Revision G

Page

•

Added Device Comparison Table........................................................................................................................................... 4

•

Changed pin names for all devices and all packages ............................................................................................................ 5

•

Changed pin names and I/O designation on some TLV9001 pins ........................................................................................ 5

•

Changed the pin number for V+ in the SOIC, TSSOP column of the Pin Functions: TLV9004 table.................................. 10

Changes from Revision E (July 2018) to Revision F

Page

•

Added Scalabe CMOS Amplifier for Low-Cost Applications feature ...................................................................................... 1

•

Deleted PREVIEW designation on TLV9002 and TLV9004 devices with the TSSOP package. .......................................... 1

•

Added TLV9001U DBV (SOT-23) pinout drawing to Pin Configuration and Functions section ............................................ 5

•

Added SOT-23 U Pinout to Pin Functions section ................................................................................................................ 5

Changes from Revision D (June 2018) to Revision E

Page

•

Corrected typo in Description section .................................................................................................................................... 1

•

Added TLV9001 5-pin X2SON package to Device Information table .................................................................................... 1

•

Added TLV9001S 6-pin SOT-23 package to Device Information table.................................................................................. 1

•

Added TLV9004 14-pin and 16-pin WQFN packages to Device Information table ............................................................... 1

•

Added TLV9001 DPW (X2SON) pinout drawing to Pin Configuration and Functions section ............................................... 5

•

Added TLV9001S 6-pin SOT-23 package to Pin Configuration and Functions section ......................................................... 6

•

Added TLV9004 RTE pinout information to Pin Configuration and Functions section .......................................................... 9

•

Added DPW (X2SON) and DRL (SOT-553) packages to Thermal Information: TLV9001 table ......................................... 13

•

Added Thermal Information: TLV9001S table to Specifications section .............................................................................. 13