| Manufacturer | Part # | Datasheet | Description |
 Amkor Technology |
TFBGA
|
746Kb / 2P |
Amkor’s ChipArray® Ball Grid Array (CABGA) laminate based packages are compatible with SMT mounting processes worldwide.
06/19 |
 NXP Semiconductors |
TFBGA100
|
2Mb / 153P |
32-bit ARM Cortex-M4/M0 MCU; up to 264 kB SRAM; Ethernet; two High-speed USBs; advanced configurable peripherals
Rev. 4-26 March 2013 |
|
TFBGA100
|
2Mb / 149P |
32-bit ARM Cortex-M3 MCU; up to 200 kB SRAM; Ethernet, two High-speed USB, LCD, and external memory controller
Rev. 6.1-7 February 2013 |
|
TFBGA100
|
405Kb / 69P |
Single-chip 16-bit/32-bit ocontrollers; up to 512 kB flash with ISP/IAP, Ethernet, USB 2.0, CAN, and 10-bit ADC/DAC
Rev. 7.1-16 October 2013 |
|
TFBGA100
|
405Kb / 69P |
Single-chip 16-bit/32-bit ocontrollers; up to 512 kB flash with ISP/IAP, Ethernet, USB 2.0, CAN, and 10-bit ADC/DAC
Rev. 7.1-16 October 2013 |