FEATURES
■ Access Times 15, 17, 20, 25, 35, 45, 55ns
■ MIL-STD-883 Compliant Devices Available
■ Revolutionary, Center Power/Ground Pinout JEDEC Approved
   ■ 36 lead Ceramic SOJ (Package 100)
   ■ 36 lead Ceramic Flat Pack (Package 226)
■ Evolutionary, Corner Power/Ground Pinout JEDEC Approved
   ■ 32 pin Ceramic DIP (Package 300)
   ■ 32 lead Ceramic SOJ (Package 101)
   ■ 32 lead Ceramic Thinpack™ Flat Pack (Package 321)
■ 32 pin, Rectangular Ceramic Leadless Chip Carrier (Package 601)
■ Commercial, Industrial and Military Temperature Range
■ 5V Power Supply
■ Low Power CMOS
■ Low Power Data Retention for Battery Back-up Operation
■ TTL Compatible Inputs and Outputs