| Manufacturer | Part # | Datasheet | Description |
Ohmite Mfg. Co. |
WNB
|
305Kb/2P |
Miniature Molded Wirewound
|
|
WNB
|
305Kb/2P |
Miniature Molded Wirewound
|
|
WNB
|
305Kb/2P |
Encapsulated by epoxy molding compound
|
WeEn Semiconductors |
WNB051C5APTS
|
2Mb/7P |
Hyperfast power diode - Bare die
|
|
WNB087C5APPS12
|
251Kb/7P |
Hyperfast power diode - Bare die
|
|
WNB087R5APPS12
|
250Kb/7P |
Ultrafast power diode - Bare die
|
|
WNB098C5APPS12
|
252Kb/7P |
Hyperfast power diode - Bare die
|
Ohmite Mfg. Co. |
WNB100FE
|
119Kb/1P |
Miniature Molded Wirewound
|
|
WNB100FE
|
305Kb/2P |
Encapsulated by epoxy molding compound
|
|
WNB10RFE
|
119Kb/1P |
Miniature Molded Wirewound
|
|
WNB10RFE
|
305Kb/2P |
Encapsulated by epoxy molding compound
|
WeEn Semiconductors |
WNB111C5APTS
|
948Kb/7P |
Hyperfast power diode - Bare die
|
|
WNB111S5APTS
|
254Kb/7P |
Ultrafast power diode - Bare die
|
|
WNB111V5APTS
|
250Kb/7P |
Ultrafast power diode - Bare die
|
|
WNB138C5APPS12
|
251Kb/7P |
Hyperfast power diode - Bare die
|
Ohmite Mfg. Co. |
WNB150FE
|
119Kb/1P |
Miniature Molded Wirewound
|
|
WNB150FE
|
305Kb/2P |
Encapsulated by epoxy molding compound
|
|
WNB15RFE
|
119Kb/1P |
Miniature Molded Wirewound
|
|
WNB15RFE
|
305Kb/2P |
Encapsulated by epoxy molding compound
|
WeEn Semiconductors |
WNB160V5SPTS
|
2Mb/7P |
Ultrafast power diode - Bare die
|
English ▼ 
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand