GT25H28DP2.2H(10) Datasheet, PDF

Manufacturer	Part #	Datasheet	Description
Hirose Electric	GT25H-12DP-2.2H	246Kb/5P	Metal holddowns to solder by reflow are used instead of screws for PCB mounting.
	GT25H-12DP-2.2V	246Kb/5P	Metal holddowns to solder by reflow are used instead of screws for PCB mounting.
	GT25H-2024SCF	246Kb/5P	Metal holddowns to solder by reflow are used instead of screws for PCB mounting.
	GT25H-20DP-2.2H	246Kb/5P	Metal holddowns to solder by reflow are used instead of screws for PCB mounting.
	GT25H-24DP-2.2H	246Kb/5P	Metal holddowns to solder by reflow are used instead of screws for PCB mounting.
	GT25H-24DP-2.2V	246Kb/5P	Metal holddowns to solder by reflow are used instead of screws for PCB mounting.
	GT25H-32DP-2.2H	246Kb/5P	Metal holddowns to solder by reflow are used instead of screws for PCB mounting.
	GT25H-32DP-2.2V	246Kb/5P	Metal holddowns to solder by reflow are used instead of screws for PCB mounting.
Toshiba Semiconductor	GT25H101	835Kb/16P	Discrete IGBTs
Hirose Electric	GT25HB-2428SCF	246Kb/5P	Metal holddowns to solder by reflow are used instead of screws for PCB mounting.

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