| Manufacturer | Part # | Datasheet | Description |
 Weidmuller |
2086510000
|
639Kb/8P
|
B2CF 3.50/12/180LR SN BK BX LRP
|
|
2086520000
|
687Kb/9P
|
B2CF 3.50/24/180LR SN BK BX LRP
|
|
2086530000
|
684Kb/9P
|
B2CF 3.50/32/180LR SN BK BX LRP
|
|
2086540000
|
632Kb/8P
|
B2CF 3.50/34/180LR SN BK BX LRP
|
 Molex Electronics Ltd. |
2086592040
|
41Kb/2P
|
2.00mm Pitch, iGrid PCB Header, Dual Row, Right-Angle, Through Hole, 0.10關m Gold(Au) Plating
|
|
2086592240
|
42Kb/2P
|
2.00mm Pitch, iGrid PCB Header, Dual Row, Right-Angle, Through Hole, 0.10關m Gold(Au) Plating
|
|
2086592640
|
41Kb/2P
|
2.00mm Pitch, iGrid PCB Header, Dual Row, Right-Angle, Through Hole, 0.10關m Gold(Au) Plating
|
|
2086593040
|
41Kb/2P
|
2.00mm Pitch, iGrid PCB Header, Dual Row, Right-Angle, Through Hole, 0.10關m Gold(Au) Plating
|
|
2086593240
|
41Kb/2P
|
2.00mm Pitch, iGrid PCB Header, Dual Row, Right-Angle, Through Hole, 0.10關m Gold(Au) Plating
|
|
2086593440
|
41Kb/2P
|
2.00mm Pitch, iGrid PCB Header, Dual Row, Right-Angle, Through Hole, 0.10關m Gold(Au) Plating
|